Abstract: A deformable array of semiconductor devices, and a method of manufacturing such a deformable array. The deformable array comprises a plurality of islands, where each island contains at least one semiconductor device, and the plurality of islands are arranged in an auxetic geometry.

Abstract: A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; releasing an element of the actuator from the sheet stock using the laser; and moving the released part relative to the sheet stock using laser ablation propulsion.

Abstract: A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; and releasing an element of the actuator from the sheet stock using the laser.

Abstract: Sensor interconnects and supports and methods of making them utilize phonon disruptors for increased thermal resistance while maintaining acceptable electrical signal quality in materials. Phonon disruptors include, but are not limited to, structural features such as interfaces, grain boundaries, and point scattering sites, for example, that are designed to scatter heat carriers while allowing electrons to pass through the material. Some embodiments herein involve designing selected stacks of alternating or sequential material pairs within sensor interconnects.

Abstract: Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

Abstract: A microelectromechanical system (MEMS) actuator device includes a substrate; a shape memory alloy over the substrate; and a reflective coating on the shape memory alloy. The shape memory alloy and the reflective coating form a bi-layer cantilever beam having a first end anchored to the substrate, and a second end released from the substrate. The second end of the cantilever beam articulates between a deflection configuration away from the substrate and a non-deflection configuration towards the substrate based on a thermal phase change in the shape memory alloy.

Abstract: A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; and releasing an element of the actuator from the sheet stock using the laser.

Abstract: A deformable array of semiconductor devices, and a method of manufacturing such a deformable array. The deformable array comprises a plurality of islands, where each island contains at least one semiconductor device, and the plurality of islands are arranged in an auxetic geometry.

Abstract: Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

Abstract: According to embodiments, an electric field sensor having a sensor electrode is constructed of an electrically conductive material and having one or more outwardly protruding pillars. A screen electrode overlies the sensor electrode and has one or more openings which register with the one or more pillars on the sensor electrode. At least one piezoelectric actuator is connected to the screen electrode so that, when excited by a voltage signal, the piezoelectric actuator modulates the screen electrode toward and away from the sensor electrode at the frequency of the periodic voltage signal. An output circuit configured to detect a voltage, a current output, or both, between the sensor electrode and the screen electrode which is proportional in magnitude to the strength of the electric field.

Abstract: According to embodiments, an electric field sensor having a sensor electrode is constructed of an electrically conductive material and having one or more outwardly protruding pillars. A screen electrode overlies the sensor electrode and has one or more openings which register with the one or more pillars on the sensor electrode. At least one piezoelectric actuator is connected to the screen electrode so that, when excited by a voltage signal, the piezoelectric actuator modulates the screen electrode toward and away from the sensor electrode at the frequency of the periodic voltage signal. An output circuit configured to detect a voltage, a current output, or both, between the sensor electrode and the screen electrode which is proportional in magnitude to the strength of the electric field.

Abstract: A physical structure and a method for forming a electronic devices on a substrate comprising: providing a substrate; forming a plurality of layers on the substrate, the layers comprising at least two layers of conducting material and a layer of insulating material therebetween; depositing photoresist material onto predetermined regions of the plurality of layers, the photoresist material varying in thickness; utilizing gray scale illumination on the photoresist material; removing a portion of the layers using physical etching to expose predetermined portions of the conducting layers. Optionally, the photoresist may be utilized on a plurality of discrete electronic devices concurrently, such that the gray scale illumination is conducted on a plurality of discrete electronic devices concurrently. Similarly, the physical etching may be conducted on the discrete electronic devices concurrently; removing different thicknesses of material concurrently. Also claimed is a product made by the claimed method.

Abstract: An acceleration switch array having at least two acceleration switches. Each acceleration switch includes a substrate, an anchor attached to the substrate, an electrically conductive mass disposed around the anchor and secured to the anchor by a spring assembly which permits movement of the mass relative to the anchor, and a plurality of electrical contacts positioned at circumferentially spaced positions around and outwardly from the mass. These electrical contacts are aligned along at least one orthogonal axis. A resistor array is electrically connected between the electric contacts of each acceleration switch for each orthogonal axis so that, upon contact between the mass and any of the electrical contacts, an electrical resistance is presented at an output terminal that is unique for each electrical contact for each acceleration switch.

Abstract: A method of forming a device on a substrate comprising creating a depository and at least one attached capillary; the depository being of millimeter scale; providing a liquid containing particles in the range 1 nanometer to 1 millimeter; depositing into the depository the liquid containing particles which flows into at least one capillary by capillary action; evaporating the liquid such that the particles form an agglomerate beginning at the end of the at least one capillary with a substantially uniform distribution of the particles within the agglomerate; which is used to form a device. A microelectronic integrated circuit device comprising a substrate; a depository coupled to said substrate, the depository being formed by at least one wall adjacent to the substrate; at least one capillary channel coupled to at least one depository that is formed by walls adapted to be filled with a liquid (by capillary action) comprising nanoparticles.

Abstract: An acceleration switch array having at least two acceleration switches. Each acceleration switch includes a substrate, an anchor attached to the substrate, an electrically conductive mass disposed around the anchor and secured to the anchor by a spring assembly which permits movement of the mass relative to the anchor, and a plurality of electrical contacts positioned at circumferentially spaced positions around and outwardly from the mass. These electrical contacts are aligned along at least one orthogonal axis. A resistor array is electrically connected between the electric contacts of each acceleration switch for each orthogonal axis so that, upon contact between the mass and any of the electrical contacts, an electrical resistance is presented at an output terminal that is unique for each electrical contact for each acceleration switch.

Abstract: An ultra-miniature, electro-mechanical, MEMS type safe and arming (S&A) device for medium- or large-artillery rounds, including, three sequenced S&A interlocks: a setback slider which provides a 1st interlock with respect to an arming slider which moves due to the round's spin; a stop and release mechanism that holds the arming slider until a release command signal is initiated by the fuze circuit, triggering a spot charge which generates an expanding gas wave that flexes the latch arm from contact with the safety catch, unlocking the 2nd interlock, thereby freeing the arming slider to continue its motion into an arming position, unlocking the 3rd interlock, and aligning the parts of the firetrain within the device, such that upon signal from the fuze circuit to an output charge, the device will ignite the acceptor charge within the round.

Abstract: A method of forming a device on a substrate comprising creating a depository and at least one attached capillary; the depository being of millimeter scale; providing a liquid containing particles in the range 1 nanometer to 1 millimeter; depositing into the depository the liquid containing particles which flows into at least one capillary by capillary action; evaporating the liquid such that the particles form an agglomerate beginning at the end of the at least one capillary with a substantially uniform distribution of the particles within the agglomerate; which is used to form a device. A microelectronic integrated circuit device comprising a substrate; a depository coupled to said substrate, the depository being formed by at least one wall adjacent to the substrate; at least one capillary channel coupled to at least one depository that is formed by walls adapted to be filled with a liquid (by capillary action) comprising nanoparticles.

Abstract: A ultra-miniature, electro-mechanical, MEMS type safe and arming (S&A) device for medium- or large-artillery rounds, including, three sequenced S&A interlocks: a setback slider, which is positioned partially within and partially extending from an arming slider, such that, upon firing acceleration, the setback slider will compress into a channel within the arming slider (unlocking the 1st interlock); freeing the arming slider to move toward its arming position under urging of the round's spin; a stop and release mechanism formed by a flexible latch arm which impacts upon a safety catch located within the frame in which the arming slider is mounted, such that the arming slider is stopped until a release command signal is initiated by the fuze circuit, triggering a spot charge which generates an expanding gas wave that flexes the latch arm from contact with the safety catch (unlocking the 2nd interlock), thereby freeing the arming slider to continue its motion into an arming position (unlocking the 3rd i

Abstract: A MEMS contact acceleration switch may include a first non-conductive layer; a second, conductive layer next to the first layer; and a third, conductive layer next to the second layer. The third layer may include a generally circular, annular mass and a center anchor post disposed interior of the annular mass. At least one spiral spring may connect the annular mass to the center anchor post. The third layer may include an x-y plane detection electrode separated from the annular mass by a gap. A fourth conductive layer may be disposed next to the third layer. A fifth layer may be disposed next to the fourth layer and may include a z-axis detection electrode. A second z-axis detection electrode may be disposed on the first layer. A plurality of conductive vias may extend through the first layer and be in electrical communication with the detection electrodes.

Abstract: An inertial shock bandpass filter for detecting a shock event between first and second acceleration levels. The inertial shock bandpass filter includes a primary inertial element and at least one secondary inertial element supported by respective spring arrangements. The inertial elements include complementary engageable gripping surfaces, which engage in response to an acceleration above the second acceleration level to prevent movement of the primary inertial element and prevent latch engagement. The primary inertial element will, in response to an acceleration between the first and second acceleration levels, engage the latch. An acceleration level below the first acceleration level is insufficient to cause either an engagement of the gripping surfaces or a latching of the primary inertial element.