Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.

Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

Abstract: A system, method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.

Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.

Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.

Abstract: In a capacitor microphone system for directional applications, an array of backplates of microphone cells are formed on a printed circuit (PC) board. A continuous strip of diaphragm is employed to cover each backplate. The diaphragm is stretched to create a uniform tension along its length, contributing to the objective of achieving a uniform gain by each microphone cell. In addition, the diaphragm is separated from the backplates by a relatively large distance such that the percentage deviation from such a distance from cell to cell is relatively small, again contributing to the objective of gain uniformity.

Abstract: A system for monitoring the integrity of electrical connections includes a transformer with its primary coupled across a dual split contact arrangement and the secondary coupled to both an energy source and a monitoring circuit. When the contact condition is made the secondary impedance reaches a given value which results in a low output indicated by the monitoring circuit. The energy source is preferably a radio frequency oscillator driving the transformer secondary, which is also connected to a monitoring circuit. Preferably, the output from a current reference circuit, coupled to the secondary of the transformer, is coupled to the energy source circuit and the monitoring circuit so as to produce a given output in the monitoring circuit when the contact condition is made.

Abstract: A phototransistor is operated with a floating base but with the transistor operating point defined by prebiasing the base, typically by injecting the base current through a prebias emitter in the collector region outside of the depletion layer. The phototransistor has a signal to noise ratio comparable to those of optimized avalanche photodiodes but operates at a significantly lower voltage and without need for temperature compensation. The phototransistor is especially well-suited for optical communications at high data rates.

Abstract: An electromagnetic signal processor intended, for use, primarily, in the hundred kilohertz to the several hundred megahertz range includes a filtering or wave shaping first stage. The filtering stage (or filter, if constructed as a separate unit) includes a length of lumped or continuous electromagnetic transmission line with all or a portion of the shunt capacitance, at each point along the line, being connected to a low input impedance summing device. The longitudinal distribution of capacitance, thus connected, determines the frequency response of the processor. Particularly simple realizations involving transmission lines with split ground planes and operational integrators are disclosed. Use in communications systems and nuclear instrumentation is discussed.

Abstract: The electrical conductivity of a lamella of conducting material (e.g., semiconductor wafers or metal films) is measured by introducing the lamella into the oscillatory magnetic field of the inductive element of the L-C tank circuit. The tank circuit is the frequency determining portion of an oscillator which is adjusted, upon sample introduction, to restore the magnitude of oscillation. With suitable choice of circuit parameters, the incremental current in the tank circuit is linearly proportional to the sheet conductivity of the lamella. An exemplary apparatus, operating at approximately 10 MHz with a 1 cm.sup.2 measurement area exhibited approximately 1% linearity over a 100 to 1 range of conductivity with a resolution of approximately one part in 10.sup.4 with a limiting sensitivity of 10.sup.11 carriers per square cm.