Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Abstract: A microelectronic device may include a substrate, a first component, a second component, a slug, a heat spreader, and a heatsink. The substrate may include a plurality of electrically conductive elements. The first component may be coupled to the substrate. The second component may be coupled to the substrate. The slug may be thermally coupled to the second component. The heat spreader may be in contact with the substrate, where the heat spreader may be thermally coupled to the first component. The heatsink may be thermally coupled to the heat spreader and the slug.

Abstract: The invention provides a lighting device comprising a light source and a light converter, wherein the light source is configured to provide light source light, wherein the light converter comprises a donor luminescent material able to convert at least part of the first light source light into donor light, and a acceptor luminescent material, wherein the donor luminescent material and acceptor luminescent material are configured as donor-acceptor luminescent materials which, upon excitation of the donor luminescent material by the light source light provide acceptor light having an acceptor light spectral distribution different from a donor light spectral distribution of the donor light, wherein the light converter further comprises a periodic plasmonic antenna array configured to enhance generation of said donor light, and wherein the lighting device is configured to provide lighting device light comprising said donor light and said acceptor light.

Abstract: The invention provides a lighting device comprising a light source and a light converter, wherein the light source is configured to provide light source light, wherein the light converter comprises a donor luminescent material able to convert at least part of the first light source light into donor light, and a acceptor luminescent material, wherein the donor luminescent material and acceptor luminescent material are configured as donor-acceptor luminescent materials which, upon excitation of the donor luminescent material by the light source light provide acceptor light having an acceptor light spectral distribution different from a donor light spectral distribution of the donor light, wherein the light converter further comprises a periodic plasmonic antenna array configured to enhance generation of said donor light, and wherein the lighting device is configured to provide lighting device light comprising said donor light and said acceptor light.