Abstract: Embodiments of the present disclosure include an electrical receptacle, comprising a base formed of electrically insulating material and arranged to hold at least one pair of electrically conductive terminals, and a cover formed of electrically insulating material and configured to be joinable with the base. The cover can comprise a top portion having a bottom surface, and at least one separating tab attached to the bottom surface at an angle of ˜90 degrees. Each separating tab can be arranged to separate opposite terminals, of a terminal pair, only when the cover is at least partially joined with the base. Base and cover can include, respectively, locking tabs and receptacles configured to engage when base and cover are fully joined. Embodiments also include power supply circuits comprising a DC-AC inverter, a load protection circuit, and embodiments of the electrical receptacle. Embodiments also include methods for protecting a power supply circuit.

Abstract: A lead frame assembly having a lead frame made of a single layer, a housing substantially surrounding the lead frame, and a plurality of leads formed as part of the lead frame. The lead frame assembly also includes a plurality of interfaces, allowing various devices to interact with the lead frame, such as sensors, thermistors, solenoids, engine controllers, or electronic control units, or the like. The interfaces may be formed as part of the lead frame, oriented in different directions, and may be located in different planes, making the lead frame assembly suitable for applications with different packaging requirements. The interfaces may be a plurality of connectors, where one of the connectors has multiple rows of pins which are in communication with the rest of the connectors, facilitating the communication between the connector and various devices.

Abstract: A lead frame assembly having a lead frame made of a single layer, a housing substantially surrounding the lead frame, and a plurality of leads formed as part of the lead frame. The lead frame assembly also includes a plurality of interfaces, allowing various devices to interact with the lead frame, such as sensors, thermistors, solenoids, engine controllers, or electronic control units, or the like. The interfaces may be formed as part of the lead frame, oriented in different directions, and may be located in different planes, making the lead frame assembly suitable for applications with different packaging requirements. The interfaces may be a plurality of connectors, where one of the connectors has multiple rows of pins which are in communication with the rest of the connectors, facilitating the communication between the connector and various devices.

Abstract: A lead frame assembly having a lead frame made of a single layer, a housing substantially surrounding the lead frame, and a plurality of leads formed as part of the lead frame. The lead frame assembly also includes a plurality of interfaces, allowing various devices to interact with the lead frame, such as sensors, thermistors, solenoids, engine controllers, or electronic control units, or the like. The interfaces may be formed as part of the lead frame, oriented in different directions, and may be located in different planes, making the lead frame assembly suitable for applications with different packaging requirements. The interfaces may be a plurality of connectors, where at least one of the plurality of connectors are disposed in the same plane as the lead frame, and another of the plurality of connectors is disposed in a different plane from the lead frame.

Abstract: A lead frame assembly having a lead frame made of a single layer, a housing substantially surrounding the lead frame, and a plurality of leads formed as part of the lead frame. The lead frame assembly also includes a plurality of interfaces, allowing various devices to interact with the lead frame, such as sensors, thermistors, solenoids, engine controllers, or electronic control units, or the like. The interfaces may be formed as part of the lead frame, oriented in different directions, and may be located in different planes, making the lead frame assembly suitable for applications with different packaging requirements. The interfaces may be a plurality of connectors, where at least one of the plurality of connectors are disposed in the same plane as the lead frame, and another of the plurality of connectors is disposed in a different plane from the lead frame.