Patents by Inventor Gabriele CANZI

Gabriele CANZI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aperture size modulation to enhance ebeam patterning resolution
    Patent number: 10395883
    Abstract: Lithographic apparatuses suitable for complementary e-beam lithography (CEBL) are described. In an example, a blanker aperture array (BAA) for an e-beam tool includes a first column of openings along a first direction and having a pitch. Each opening of the first column of openings has a dimension in the first direction. The BAA also includes a second column of openings along the first direction and staggered from the first column of openings. The second column of openings has the pitch. Each opening of the second column of openings has the dimension in the first direction. A scan direction of the BAA is along a second direction orthogonal to the first direction. The openings of the first column of openings overlap with the openings of the second column of openings by at least 5% but less than 50% of the dimension in the first direction when scanned along the second direction.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: August 27, 2019
    Assignee: Intel Corporation
    Inventors: Shakul Tandon, Mark C. Phillips, Gabriele Canzi
  • APERTURE SIZE MODULATION TO ENHANCE EBEAM PATTERNING RESOLUTION
    Publication number: 20190013175
    Abstract: Lithographic apparatuses suitable for complementary e-beam lithography (CEBL) are described. In an example, a blanker aperture array (BAA) for an e-beam tool includes a first column of openings along a first direction and having a pitch. Each opening of the first column of openings has a dimension in the first direction. The BAA also includes a second column of openings along the first direction and staggered from the first column of openings. The second column of openings has the pitch. Each opening of the second column of openings has the dimension in the first direction. A scan direction of the BAA is along a second direction orthogonal to the first direction. The openings of the first column of openings overlap with the openings of the second column of openings by at least 5% but less than 50% of the dimension in the first direction when scanned along the second direction.
    Type: Application
    Filed: March 31, 2016
    Publication date: January 10, 2019
    Inventors: Shakul TANDON, Mark C. PHILLIPS, Gabriele CANZI