Patents by Inventor Gabriele GAERTNER

Gabriele GAERTNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230110025
    Abstract: The present invention relates to a process for producing silica-based thermal insulation moulded body comprising at least 50% by weight of synthetic amorphous silica and not more than 50% by weight of natural silica with a specified particle size, thermal insulation moulded body obtainable by this process and the use thereof for thermal and/or acoustic insulation.
    Type: Application
    Filed: February 15, 2021
    Publication date: April 13, 2023
    Applicant: EVONIK OPERATIONS GMBH
    Inventors: Gabriele Gärtner, Vanessa KIMMEL, Bettina GERHARZ-KALTE, Alexander LYGIN
  • Patent number: 11565974
    Abstract: The present invention relates to a granular thermal insulation material comprising hydrophobized silicon dioxide and at least one IR opacifier, having a tamped density of up to 250 g/l and a compressive strength according to DIN EN 826:2013 at 50% compression of 150 to 300 kPa or greater than 300 kPa, to processes for production thereof and to the use thereof for thermal insulation.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: January 31, 2023
    Assignee: Evonik Operations GmbH
    Inventors: Matthias Geisler, Ann-Kathrin Herr, Christian Moers, Gabriele Gärtner
  • Patent number: 11427506
    Abstract: Process for producing a thermally insulating mixture comprising hydrophobic silica, in which a) a pulverulent carrier material selected from the group consisting of precipitated silicas, SiO2 aerogels, pearlites and mixtures thereof is coated with a liquid silicon compound, where the liquid silicon compound has at least one alkyl group and a boiling point of less than 200° C., and b) the pulverulent carrier material that has thus been coated with the liquid silicon compound is mixed with a composition comprising a pulverulent hydrophilic fumed silica and the mixture is subjected to thermal treatment at more than 40° C. and c) any unreacted silicon compound is subsequently removed from the thermally treated mixture, thus giving the thermally insulating mixture comprising hydrophobic silica.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: August 30, 2022
    Assignee: Evonik Operations GmbH
    Inventors: Thorsten Schultz, Matthias Geisler, Maciej Olek, Juri Tschernjaew, Hark-Oluf Asbahr, Gabriele Gärtner
  • Publication number: 20210292238
    Abstract: The present invention relates to a process for producing a hydrophobized shaped thermal-insulation body, comprising pressing or compacting a thermal-insulation mixture containing a silica, an IR opacifier, an organosilicon compound A and an organosilicon compound B, wherein organosilicon compound A is hexamethyldisilazane (HMDS) and organosilicon compound B corresponds to a substance of the formula RnSiX4-n, where R=hydrocarbyl radical having 1 to 18 carbon atoms, n=0, 1 or 2, X=Cl, Br or alkoxy group —OR1 where R1=hydrocarbyl radical having 1 to 8 carbon atoms, or organosilicon compound B corresponds to a silanol of the formula HO[—Si(CH3)2O—]mH, where m=2-100.
    Type: Application
    Filed: July 8, 2019
    Publication date: September 23, 2021
    Applicant: EVONIK OPERATIONS GMBH
    Inventors: Uwe Albinus, Jürgen MEYER, Gabriele GÄRTNER
  • Patent number: 10618849
    Abstract: Process for the production of a hydrophobic thermal-insulation moulding, where a hydrophilic thermal-insulation moulding is brought into contact with a hydrophobizing agent in vapour form with formation of a thermal-insulation moulding coated with hydrophobizing agent, and this is then subjected to a press process and during the press process and/or after the press process is reacted with the hydrophobizing agent with formation of the hydrophobic thermal-insulation moulding, where a) the density of the hydrophobic thermal-insulation moulding after the press process and after the reaction with the hydrophobizing agent is from 100 to 250 kg/m3, and b) the density of the hydrophilic thermal-insulation moulding on contact with the hydrophobizing agent is from 50% to less than 100% of the density of the hydrophobic thermal-insulation moulding.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: April 14, 2020
    Assignee: Evonik Operations GmbH
    Inventors: Uwe Albinus, Johannes Daenner, Manfred Dannehl, Matthias Schindler, Gabriele Gaertner
  • Publication number: 20200031720
    Abstract: The present invention relates to a granular thermal insulation material comprising hydrophobized silicon dioxide and at least one IR opacifier, having a tamped density of up to 250 g/l and a compressive strength according to DIN EN 826:2013 at 50% compression of 150 to 300 kPa or greater than 300 kPa, to processes for production thereof and to the use thereof for thermal insulation.
    Type: Application
    Filed: January 18, 2018
    Publication date: January 30, 2020
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Matthias GEISLER, Ann-Kathrin HERR, Christian MOERS, Gabriele GÄRTNER
  • Publication number: 20190276358
    Abstract: Process for producing a thermally insulating mixture comprising hydrophobic silica, in which a) a pulverulent carrier material selected from the group consisting of precipitated silicas, SiO2 aerogels, pearlites and mixtures thereof is coated with a liquid silicon compound, where the liquid silicon compound has at least one alkyl group and a boiling point of less than 200° C., and b) the pulverulent carrier material that has thus been coated with the liquid silicon compound is mixed with a composition comprising a pulverulent hydrophilic fumed silica and the mixture is subjected to thermal treatment at more than 40° C. and c) any unreacted silicon compound is subsequently removed from the thermally treated mixture, thus giving the thermally insulating mixture comprising hydrophobic silica.
    Type: Application
    Filed: July 13, 2017
    Publication date: September 12, 2019
    Applicant: Evonik Degussa GmbH
    Inventors: Thorsten SCHULTZ, Matthias GEISLER, Maciej OLEK, Juri TSCHERNJAEW, Hark-Oluf ASBAHR, Gabriele GÄRTNER
  • Publication number: 20170268221
    Abstract: Thermal insulation body comprising a thermally insulating core having holes filled with a capillary-active material, wherein the thermally insulating core is capillary-inactive and the capillary-active material in the holes comprises capillary-active wicks.
    Type: Application
    Filed: January 11, 2016
    Publication date: September 21, 2017
    Applicant: Evonik Degussa GmbH
    Inventors: Matthias GEISLER, Gabriele GAERTNER
  • Publication number: 20170233297
    Abstract: Process for the production of a hydrophobic thermal-insulation moulding, where a hydrophilic thermal-insulation moulding is brought into contact with a hydrophobizing agent in vapour form with formation of a thermal-insulation moulding coated with hydrophobizing agent, and this is then subjected to a press process and during the press process and/or after the press process is reacted with the hydrophobizing agent with formation of the hydrophobic thermal-insulation moulding, where a) the density of the hydrophobic thermal-insulation moulding after the press process and after the reaction with the hydrophobizing agent is from 100 to 250 kg/m3, and b) the density of the hydrophilic thermal-insulation moulding on contact with the hydrophobizing agent is from 50% to less than 100% of the density of the hydrophobic thermal-insulation moulding.
    Type: Application
    Filed: July 27, 2015
    Publication date: August 17, 2017
    Applicant: Evonik Degussa GmbH
    Inventors: Uwe ALBINUS, Johannes DAENNER, Manfred DANNEHL, Matthias SCHINDLER, Gabriele GAERTNER