Abstract: In various embodiments, an inductor package comprises a first inductor that is arranged in a first orientation and produces a first magnetic flux in a first direction; and a second inductor that is arranged in a second orientation and produces a second magnetic flux in a second direction that at least partially cancels the first magnetic flux, where the first direction is opposite the second direction. In some embodiments, a printed circuit board assembly comprises a printed circuit board (PCB) layer, a first inductor that is arranged on the PCB layer at a first orientation and produces a first magnetic flux in a first direction, and a second inductor that is arranged on the PCB layer at a second orientation and produces a second magnetic flux in a second direction that at least partially cancels the first magnetic flux.

Abstract: A power control circuit to control data center power delivery is disclosed. In at least one embodiment, the power control circuit may be configured to selectively cause at least a portion of a supplied power to be directed to one or more server racks or to charge one or more batteries based, at least in part on, one or more charge levels corresponding to the one or more batteries.

Abstract: A flexible cold plate assembly may include a flexible cold plate which allows for conformance or flexing to support warping associated with an underlying computing component. The conformance or flexing may be based, at least in part, on one or more of a thin base plate, on heat removal surface extensions of the flexible cold plate assembly having multiple cross-cuts therein, or a distribution seal having conformance or flexing properties. The cross-cuts may be perpendicular to a direction of flow of a fluid through the heat removal surface extensions to provide the conformance or flexing in the flexible cold plate.

Abstract: A deformation assembly, in at least one aspect, may support a cold plate assembly or may be part of the cold plate assembly which includes a cold plate. The deformation assembly may allow a controlled deformation to the cold plate. The controlled deformation may deform the cold plate to a predetermined curvature of a computing component.

Abstract: Example graphics processing subsystems and computing devices that include the graphics processing subsystem(s) are described. In one example, the graphics processing subsystem may comprise a first fan, a second fan and a printed circuit board (PCB) on which a processor is disposed. The first fan may be associated with a first axis about which the first fan is rotatable. The second fan may be associated with a second axis about which the second fan is rotatable. The PCB may be shaped and positioned such that (a) a first airflow path for cooling the processor traverses through the first fan and a first opening below the first fan, and (b) a second airflow path for cooling the processor traverses through the second fan and a second opening below the second fan. The first airflow path and the second airflow path are substantially linear relative to the respective first axis and second axis.

Abstract: Embodiments described herein provide a data center system comprising one or more busbars each having two parallel metallic portions and one insulating portion placed in-between to form one or more capacitors connected between a power supply and one or more computing hardware to store electrical energy. In at least one embodiment, the one insulating portion is a separate layer made of dielectric material that is inserted between the two parallel metallic portions.

Abstract: According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.

Abstract: According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.

Abstract: A printed circuit board (PCB) includes an exterior section having a first set of layers including an outermost conductive layer. The PB further includes an interior section, adjacent to the exterior section, having a second set of layers including a first conductive layer corresponding to a first end of the interior section, a second conductive layer corresponding to a second end of the interior section opposite the first end, and a third conductive layer disposed between the first conductive layer and the second conductive layer. The exterior section further includes a set of vias extending from an outermost conductive layer to the first conductive layer. The interior section further includes a buried skip via extending from the first conductive layer to the third conductive layer.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a blower, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU similarly occupies just a portion of the width of the graphics subsystem. The blower is disposed adjacent to the PCB and heat sink and configured to occupy the full height of the graphics subsystem. The blower is further configured to intake air from both the top side of the graphics subsystem and the bottom side of the graphics subsystem. In this configuration, the blower provides an elevated air flow rate in order to facilitate cooling of the PCB and/or GPU.

Abstract: A portable computing device comprises: a base portion that includes a keyboard; and a display portion that is movably coupled to the base portion and includes: a heat sink with cooling fins; one or more heat-generating electronic devices that are thermally coupled to the heat sink; and at least one cooling fan configured to direct cooling air across the cooling fins.

Abstract: According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.

Abstract: A computing device comprises: a heat sink that has a plurality of cooling fins and a vapor chamber; one or more heat-generating electronic devices that are thermally coupled to the vapor chamber; and at least one cooling fan configured to direct cooling air across the plurality of cooling fins, wherein a first fin included in the plurality of cooling fins and a second fin included in the plurality of cooling fins form a first air passage that has a first air inlet opening and a first air outlet opening, and wherein the first fin is adjacent to the second fin, and a first distance between the first fin and the second fin proximate to the first air inlet opening is less than a second distance between the first fin and the second fin proximate to the first air outlet opening.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.

Abstract: A computing device comprises: a base portion; a display portion that is movably coupled to the base portion and includes a housing having a movable panel and one or more fixed panels; and a mechanical assembly that positions the movable panel away from the one or more fixed panels as the display portion opens away from the base portion.

Abstract: Various embodiments disclose a system that includes a first source processor that generates a first stream of graphics data, a second source processor that generates a second stream of graphics data, a display device that displays at least one of the first stream of graphics data and the second stream of graphics data, and a timing controller that is coupled to the first source processor and the second source processor and receives a first control signal to enter into a self-refresh state, in response, enters into the self-refresh state, causes the display device to display a first frame stored in memory, wherein the first frame includes at least a portion of data included in the first stream of graphics data, receives a second stream of graphics data, exits the self-refresh state, and causes the display device to display the second stream of graphics data.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a blower, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU similarly occupies just a portion of the width of the graphics subsystem. The blower is disposed adjacent to the PCB and heat sink and configured to occupy the full height of the graphics subsystem. The blower is further configured to intake air from both the top side of the graphics subsystem and the bottom side of the graphics subsystem. In this configuration, the blower provides an elevated air flow rate in order to facilitate cooling of the PCB and/or GPU.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.