Abstract: A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.

Abstract: A water probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.

Abstract: A test probe aligner for aligning a test probe card with devices under test of a wafer is provided. The test probe aligner includes a backer plate arranged with its bottom side to the test probe card, and a stiffener mounted to the test probe card outside a horizontal dimension of the backer plate. The stiffener and a top side of the backer plate end in a same plane above the test probe card. The alignment further includes a bridge beam locked to a top side of the stiffener. Furthermore, the test probe aligner also includes at least two actuators and at least two corresponding force measurement sensors below a top surface of the bridge beam, arranged such that forces are applicable to the test probe card.

Abstract: A backing apparatus for use in a semiconductor automatic test equipment including: a probe card holder configured to rigidly affix one or more first portions of a flexible probe card to the probe card holder, wherein a respective back side of each of the one or more first portions is adjacent to the probe card holder when the one or more portions are rigidly affixed to the probe card holder; linear actuators; and a rigid backing plate configured to rigidly affix a second portion of the flexible probe card to the rigid backing plate, wherein one side of the rigid backing plate is adjacent to a back side of the second portion when the second portion is rigidly affixed to the rigid backing plate, wherein each linear actuator is configured to provide backing of another side of the rigid backing plate against the probe card holder.

Abstract: A test probe aligner for aligning a test probe card with devices under test of a wafer is provided. The test probe aligner includes a backer plate arranged with its bottom side to the test probe card, and a stiffener mounted to the test probe card outside a horizontal dimension of the backer plate. The stiffener and a top side of the backer plate end in a same plane above the test probe card. The alignment further includes a bridge beam locked to a top side of the stiffener. Furthermore, the test probe aligner also includes at least two actuators and at least two corresponding force measurement sensors below a top surface of the bridge beam, arranged such that forces are applicable to the test probe card.

Abstract: A water probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.

Abstract: A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.

Abstract: A backing apparatus for use in a semiconductor automatic test equipment including: a probe card holder configured to rigidly affix one or more first portions of a flexible probe card to the probe card holder, wherein a respective back side of each of the one or more first portions is adjacent to the probe card holder when the one or more portions are rigidly affixed to the probe card holder; linear actuators; and a rigid backing plate configured to rigidly affix a second portion of the flexible probe card to the rigid backing plate, wherein one side of the rigid backing plate is adjacent to a back side of the second portion when the second portion is rigidly affixed to the rigid backing plate, wherein each linear actuator is configured to provide backing of another side of the rigid backing plate against the probe card holder.