Patents by Inventor Gabriele Piccinini

Gabriele Piccinini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935699
    Abstract: Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: March 19, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Evangelista Boni, Federico Fantini, Gabriele Piccinini, Walter Bruno
  • Publication number: 20220328246
    Abstract: Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 13, 2022
    Inventors: Evangelista Boni, Federico Fantini, Gabriele Piccinini, Walter Bruno