Abstract: A process for wet chemical metallization of a substrate includes the steps of cleansing the substrate to be metalized; precipitating an electrically highly conductive gas and vapor permeable metal base layer onto the cleansed substrate from a wet chemical metallization bath; precipitating a metal layer which is comprised of at least one metal and at least one kind of non-metallic particles onto the metal base layer by electrolytic deposition from a bath comprised of at least one electrolyte; and at least one kind of finely dispersed non-metallic particles and subjecting the metallized substrate to at least one heat treatment whereby volatile components embedded in the metal base layer and the metal layer are removed and the volume of the non-metallic particles in the metal layer is reduced. In a preferred embodiment the metal layer is comprised of copper and about 5 percent by weight of ceramic particles having a diameter of less than 10 .mu.m.

Abstract: To metallize a preferably glass-like body with good adhesion of the metal, the glass-like body is coated with a thin layer of an indium-tin alloy, whereupon a catalytic germination layer is produced for currentless chemical metal precipitation by reducing a catalyst metal compound to the catalyst metal directly by the indium-tin layer or after the indium-tin layer has been reacted by salt formation or hydrolysis. After currentless chemical metallization, reinforcement may continue by electroplating with conventional metals.