Patents by Inventor Gaetan Lobascio

Gaetan Lobascio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a cover for an electronic package and electronic package comprising a cover
    Patent number: 11688815
    Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: June 27, 2023
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon
  • METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
    Publication number: 20210043780
    Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 11, 2021
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine SAXOD, Alexandre MAS, Eric SAUGIER, Gaetan LOBASCIO, Benoit BESANCON
  • Method for manufacturing a cover for an electronic package and electronic package comprising a cover
    Patent number: 10833208
    Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: November 10, 2020
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon
  • METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
    Publication number: 20200020815
    Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
    Type: Application
    Filed: September 25, 2019
    Publication date: January 16, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine SAXOD, Alexandre MAS, Eric SAUGIER, Gaetan LOBASCIO, Benoit BESANCON
  • Method for making a cover for an electronic package and electronic package comprising a cover
    Patent number: 10483408
    Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: November 19, 2019
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon
  • ELECTRONIC DEVICE HAVING A GROOVED CHIP
    Publication number: 20180190562
    Abstract: An electronic device includes a support plate having a mounting face. An electronic chip has a front face mounted on the mounting face of the support plate. A rear face of the electronic chip located opposite to the front face is provided with rear grooves that define, between the grooves, rear zones. A rear layer made of a heat-conducting material is spread over the rear face of the electronic chip so as to at least partly cover the rear zones and at least partially fill the rear grooves.
    Type: Application
    Filed: August 29, 2017
    Publication date: July 5, 2018
    Applicants: STMicroelectronics (Tours) SAS, STMicroelectronics (Grenoble 2) SAS
    Inventors: Laurent Figuiere, Gaetan Lobascio, Alexandre Mas
  • METHOD FOR MAKING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
    Publication number: 20180190838
    Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
    Type: Application
    Filed: August 29, 2017
    Publication date: July 5, 2018
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon