Patents by Inventor Gaetar L. Mathieu

Gaetar L. Mathieu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices with integral contact structures
    Patent number: 6242803
    Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
    Type: Grant
    Filed: October 21, 1996
    Date of Patent: June 5, 2001
    Assignee: FormFactor, Inc.
    Inventors: Igor Y. Khandros, Gaetar L. Mathieu
  • Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components
    Patent number: 6184587
    Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
    Type: Grant
    Filed: October 21, 1996
    Date of Patent: February 6, 2001
    Assignee: FormFactor, Inc.
    Inventors: Igor Y. Khandros, Gaetar L. Mathieu
  • Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method
    Patent number: 5900738
    Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
    Type: Grant
    Filed: October 21, 1996
    Date of Patent: May 4, 1999
    Assignee: FormFactor, Inc.
    Inventors: Igor Y. Khandros, Gaetar L. Mathieu