Patents by Inventor Gagan Kansal

Gagan Kansal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9271390
    Abstract: A semiconductor device has a multi-wire lead and a die having a multi-site bond pad. A shielding wire and a guarded wire both extend from the multi-wire lead to the multi-site bond pad. The shielding wire (or wires) provide active shielding to the guarded wire by simultaneously transmitting the same signal as the guarded wire between the multi-wire lead the multi-site bond pad.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: February 23, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Sunaina Srivastava, Raza Imam, Gagan Kansal, Sumit Varshney
  • Publication number: 20160021734
    Abstract: A semiconductor device has a multi-wire lead and a die having a multi-site bond pad. A shielding wire and a guarded wire both extend from the multi-wire lead to the multi-site bond pad. The shielding wire (or wires) provide active shielding to the guarded wire by simultaneously transmitting the same signal as the guarded wire between the multi-wire lead the multi-site bond pad.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 21, 2016
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Sunaina Srivastava, Raza Imam, Gagan Kansal, Sumit Varshney