Abstract: Phosphorous containing compounds, epoxy resins thereof, and laminate composite structures thereof. The phosphorus containing compounds may have a structure according to formula (I): wherein, X is an aromatic hydrocarbon group having 6 to 30 carbon atoms or a bivalent linear or branched alkylene group of 1 to 8 carbon atoms; RA is selected from an alkyl group having 1 to 6 carbon atoms, a phenyl group, a napthyl group, and an aromatic phenol group; w is an integer of 1 to 9; R1, R2, R3, and R4 are independently selected from H, C1-C10 alkyl, C1-C10 alkoxy, and C3-C10 cycloalkyl; R5 is selected from the group consisting of C1-C10 alkyl, C1-C10 alkoxy, C3-C10 cycloalkyl, and Ar3; and Ar1 and Ar2 are independently selected.

Abstract: Phosphorous containing compounds, epoxy resins thereof, and laminate composite structures thereof. The phosphorus containing compounds may have a structure according to formula (I): wherein, X is an aromatic hydrocarbon group having 6 to 30 carbon atoms or a bivalent linear or branched alkylene group of 1 to 8 carbon atoms; RA is selected from an alkyl group having 1 to 6 carbon atoms, a phenyl group, a napthyl group, and an aromatic phenol group; w is an integer of 1 to 9; R1, R2, R3, and R4 are independently selected from H, C1-C10 alkyl, C1-C10 alkoxy, and C3-C10 cycloalkyl; R5 is selected from the group consisting of C1-C10 alkyl, C1-C10 alkoxy, C3-C10 cycloalkyl, and Ar3; and Ar1 and Ar2 are independently selected.

Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.

Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.

Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.

Abstract: The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.

Abstract: The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

Abstract: The present invention relates to a novel water soluble polyimide resin, which contains a hydrophilic functional group such as —OH, —COOH to increase the solubility of the polyimide resin in alkali aqueous solution, and is suitable for using as an insulation film in electronic and photoelectric products. The present invention also relates to preparation and use of the above polyimide.

Abstract: The present invention provides a phosphorus-containing compound of formula (I): wherein R1, R2, R3 and R4 are the same or different; and R1, R2, R3 and R4 are independently selected from the group consisting of hydrogen, halogen, C1-8 alkyl, haloalkyl, and alkoxy. The phosphorus-containing compound is prepared by bonding a bisphenol group to a phosphorus atom to prevent the phosphorus-containing heterocyclic molecule from exhibiting steric hindrance on hydroxyl functional groups, thereby increasing reactivity in the subsequent reactions.

Abstract: The present invention relates to a novel water soluble polyimide resin, which contains a hydrophilic functional group such as —OH, —COOH to increase the solubility of the polyimide resin in alkali aqueous solution, and is suitable for using as an insulation film in electronic and photoelectric products. The present invention also relates to preparation and use of the above polyimide.

Abstract: The present invention provides a phosphorus-containing compound of formula (I): wherein R1, R2, R3 and R4 are the same or different; and R1, R2, R3 and R4 are independently selected from the group consisting of hydrogen, halogen, C1-8 alkyl, haloalkyl, and alkoxy. The phosphorus-containing compound is prepared by bonding a bisphenol group to a phosphorus atom to prevent the phosphorus-containing heterocyclic molecule from exhibiting steric hindrance on hydroxyl functional groups, thereby increasing reactivity in the subsequent reactions.

Abstract: A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability.

Abstract: A method for producing a melamine salt of bis(pentaerythritol phosphate) phosphoric acid is proposed. The method includes the steps of reacting and mixing pentaerythritol and diphosphorous pentaoxide in an extruder to carry out esterification to produce bis(pentaerythritol phosphate) phosphoric acid; and mixing bis(pentaerythritol phosphate) phosphoric acid with melamine or a derivative thereof to carry out quaternization in the presence of a solvent, followed by removing water to obtain a melamine salt of bis(pentaerythritol phosphate) phosphoric acid. Diphosphorous pentaoxide is used in the method as a reactant, so that no hydrogen chloride is produced and it is not necessary to recollect trichlorophosphoric acid. Moreover, in the method of the present invention, such that esterification time can be shortened and a high pressure in a closed reaction system that causes explosion can be avoided.

Abstract: A nonflammable resin composition comprises (A) at least an epoxy resin with biphenyl unit or naphthyl unit; (B) at least a phenolic resin used as a hardener, wherein the phenolic resin has a skeleton formed by phenyl rings bonding directly each other without interruption, and is in an amount of 30 to 100% by weight based on total hardeners; and (C) a curing catalyst. The said nonflammable resin has an excellent flame retardancy, a good heat resistance, and an improved moldability and reliability.