Patents by Inventor Gai Leong Lai

Gai Leong Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with leads and method of manufacture thereof
    Patent number: 8802500
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a die paddle, having paddle projections along a paddle peripheral side; forming a lead terminal having a lead extension with the lead extension extending towards the paddle peripheral side and between the paddle projections; mounting an integrated circuit over the die paddle; connecting the integrated circuit and the lead extension; and forming an encapsulation over the die paddle and covering the integrated circuit and lead extension.
    Type: Grant
    Filed: November 11, 2010
    Date of Patent: August 12, 2014
    Assignee: STATS ChipPAC Ltd.
    Inventors: Byung Tai Do, Linda Pei Ee Chua, Gai Leong Lai
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20110108969
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a die paddle, having paddle projections along a paddle peripheral side; forming a lead terminal having a lead extension with the lead extension extending towards the paddle peripheral side and between the paddle projections; mounting an integrated circuit over the die paddle; connecting the integrated circuit and the lead extension; and forming an encapsulation over the die paddle and covering the integrated circuit and lead extension.
    Type: Application
    Filed: November 11, 2010
    Publication date: May 12, 2011
    Inventors: Byung Tai Do, Linda Pei Ee Chua, Gai Leong Lai