Patents by Inventor GAKU HIDAI

GAKU HIDAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Signal processing apparatus and method
    Patent number: 10591953
    Abstract: The present disclosure relates to a signal processing apparatus and method that enables to reduce required power. In the signal processing apparatus, a RTC of a main chip and a RTC of a power supply chip are synchronized before power supply of the main chip is stopped, and the RTC of the main chip is synchronized with the time of the RTC of the power supply chip after the power supply of the main chip is restored. In this way, the RTC uses continuous time information before and after the stop. The present disclosure is capable of being applied to, for example, a GPS module in which a digital circuit includes a plurality of chips.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: March 17, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Sotaro Ohara, Katsuyuki Tanaka, Katsumi Takaoka, Keita Izumi, Suguru Houchi, Gaku Hidai, Yutaka Takagi, Hideki Takahashi, Hideki Awata, Yasushi Katayama, Naoki Yoshimochi, Toshimasa Shimizu
  • SIGNAL PROCESSING APPARATUS AND METHOD
    Publication number: 20180210487
    Abstract: The present disclosure relates to a signal processing apparatus and method that enables to reduce required power. In the signal processing apparatus, a RTC of a main chip and a RTC of a power supply chip are synchronized before power supply of the main chip is stopped, and the RTC of the main chip is synchronized with the time of the RTC of the power supply chip after the power supply of the main chip is restored. In this way, the RTC uses continuous time information before and after the stop. The present disclosure is capable of being applied to, for example, a GPS module in which a digital circuit includes a plurality of chips.
    Type: Application
    Filed: May 20, 2016
    Publication date: July 26, 2018
    Inventors: SOTARO OHARA, KATSUYUKI TANAKA, KATSUMI TAKAOKA, KEITA IZUMI, SUGURU HOUCHI, GAKU HIDAI, YUTAKA TAKAGI, HIDEKI TAKAHASHI, HIDEKI AWATA, YASUSHI KATAYAMA, NAOKI YOSHIMOCHI, TOSHIMASA SHIMIZU