Abstract: The present invention provides a thermally conductive composition comprising: (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a polysiloxane compound containing at least one alkyl group having 4 or more carbon atoms. According to the present invention, it is possible to provide the thermally conductive composition capable of forming a thermally conductive member having an excellent thermally conductive property and high adhesive force to polypropylene.

Abstract: The present invention relates to a battery module comprising a case, a plurality of cells arranged in the case, and a heat absorbing member disposed at least either between the case and the cell or between the plurality of cells, wherein the heat absorbing member comprises a silicone matrix and a small particle size aluminum hydroxide having a particle size of 5 ?m or less dispersed in the silicone matrix, wherein a content of the small particle size aluminum hydroxide is 20 vol % or more. According to the present investigation, a battery module capable of absorbing a generated heat at 300° C. or less for a long period of time can be provided.

Abstract: The present invention is a battery module comprising a case, a plurality of cells being arranged in the case and having an energy density of 200 Wh/L or more, and a heat absorbing member provided at least either between the case and the plurality of cells or between the plurality of cells, wherein the heat absorbing member has an endothermic quantity Q from 150° C. to 350° C. of 500 J/cm3 or more and a thermal conductivity ? of 0.8 W/mK or more. According to the present invention, there can be provided a battery module whose temperature hardly rises in an abnormal early period and in a certain period from abnormality occurrence.

Abstract: The thermally conductive composition comprises a thermally conductive filler dispersed in a liquid matrix.

Abstract: There is provided a heat-conducting composition capable of forming thick films in good productivity. The heat-conducting composition contains a binder and a heat-conducting filler, wherein a first viscosity thereof is 50 to 300 Pa·s as measured at a rotating speed of 10 rpm at 25° C. by using a rotational viscometer; and the ratio [second viscosity/first viscosity] of a second viscosity to the first viscosity is 3 to 8 where the second viscosity is a viscosity measured at a rotating speed of 1 rpm at 25° C. by using the rotational viscometer.

Abstract: The thermally conductive composition comprises a thermally conductive filler dispersed in a liquid matrix.

Abstract: A curable thermally conductive grease 1a contains a curable liquid polymer, a thermally conductive filler (A) having an average particle diameter of less than 10 ?m, and a thermally conductive filler (B) having an average particle diameter of 10 ?m or more, the ratio by volume of the thermally conductive filler (A) to the thermally conductive filler (B), i.e., (A)/(B), being 0.65 to 3.02, and the curable thermally conductive grease having a viscosity of 700 Pa·s to 2070 Pa·s, in which after the curable thermally conductive grease is applied to the heat-generating body or the heat-dissipating body to a thickness of 5 mm, the curable thermally conductive grease has slump resistance in which the curable thermally conductive grease does not flow down when the heat-generating body or the heat-dissipating body is vertically arranged.

Abstract: The silicone composition is one that contains liquid silicone, at least one insoluble functionalizing filler, such as a thermally or electrically conductive filler, and a non-liquid anti-thickening or non-thickening anti-settling material, such as a cellulose compound or polysaccharide. In a system that contains liquid silicone and insoluble functionalizing filler(s), a polysaccharide functions as an anti-thickening or non-thickening anti-settling material, providing a low-viscosity and filler-rich silicone composition.

Abstract: The silicone composition is one that contains liquid silicone, at least one insoluble functionalizing filler, such as a thermally or electrically conductive filler, and a non-liquid anti-thickening or non-thickening anti-settling material, such as a cellulose compound or polysaccharide. In a system that contains liquid silicone and insoluble functionalizing filler(s), a polysaccharide functions as an anti-thickening or non-thickening anti-settling material, providing a low-viscosity and filler-rich silicone composition.

Abstract: A curable thermally conductive grease la contains a curable liquid polymer, a thermally conductive filler (A) having an average particle diameter of less than 10 ?m, and a thermally conductive filler (B) having an average particle diameter of 10 ?m or more, the ratio by volume of the thermally conductive filler (A) to the thermally conductive filler (B), i.e., (A)/(B), being 0.65 to 3.02, and the curable thermally conductive grease having a viscosity of 700 Pa·s to 2070 Pa·s, in which after the curable thermally conductive grease is applied to the heat-generating body or the heat-dissipating body to a thickness of 5 mm, the curable thermally conductive grease has slump resistance in which the curable thermally conductive grease does not flow down when the heat-generating body or the heat-dissipating body is vertically arranged.