Abstract: A semiconductor light-emitting element includes: a semiconductor layer; an electrode disposed on the semiconductor layer, the electrode including a power feeding portion and an extension portion extending from the power feeding portion. The power feeding portion has a width greater than a width of the extension portion. The electrode includes an electrode layer and a wiring layer. The electrode layer includes a first metal layer disposed in the power feeding portion, and a second metal layer disposed closer to an extension portion side than the first metal layer is and directly connected to the first metal layer. The first metal layer and the second metal layer are in ohmic contact with the semiconductor layer. The first metal layer has an electrical conductivity higher than an electrical conductivity of the second metal layer. The wiring layer is continuously disposed on the first metal layer and the second metal layer.

Abstract: A nitride-based semiconductor laser device includes a nitride-based semiconductor layer formed on an active layer made of a nitride-based semiconductor, and an electrode layer including a first metal layer, made of Pt, formed on a far side of a surface of the nitride-based semiconductor layer from the active layer, a second metal layer, made of Pd, formed on a surface of the first metal layer, and a third metal layer, made of Pt, formed on a surface of the second metal layer, and having a shape necessary for the device in plan view. A thickness of the third metal layer is at least 10 times and not more than 30 times a thickness of the first metal layer.