Patents by Inventor Galen Cook
Galen Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958293Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: GrantFiled: June 3, 2021Date of Patent: April 16, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Patent number: 11807005Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: GrantFiled: March 28, 2023Date of Patent: November 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Lam J. Choy
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Patent number: 11712896Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.Type: GrantFiled: April 4, 2022Date of Patent: August 1, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
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Publication number: 20230234355Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-lam J. Choy
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Publication number: 20220227131Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.Type: ApplicationFiled: April 4, 2022Publication date: July 21, 2022Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
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Patent number: 11305537Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: April 19, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-Iam J Choy
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Patent number: 11247470Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: February 15, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20210291520Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: ApplicationFiled: June 3, 2021Publication date: September 23, 2021Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Patent number: 11034151Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: June 15, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20200398563Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20200398564Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20200398562Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Patent number: 9033482Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a housing configured to store a quantity of fluid and an ejection assembly configured to controllably emit the fluid through a nozzle. The fluid dispenser also includes a fluid chamber configured both to supply a quantity of the fluid to the ejection assembly and to define a fluid flow path between the housing and the ejection assembly. The fluid dispenser further includes a filter positioned in the fluid flow path and configured both to conduct the fluid from the housing to the fluid chamber and to restrain particles in the fluid from entering the fluid chamber. The filter is further configured to define a bubble flow path that facilitates conduction of bubbles from the fluid chamber to the housing. Additional features of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.Type: GrantFiled: February 21, 2012Date of Patent: May 19, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Arun Agarwal, Paul Richards, Galen Cook
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Publication number: 20140354741Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a housing configured to store a quantity of fluid and an ejection assembly configured to controllably emit the fluid through a nozzle. The fluid dispenser also includes a fluid chamber configured both to supply a quantity of the fluid to the ejection assembly and to define a fluid flow path between the housing and the ejection assembly. The fluid dispenser further includes a filter positioned in the fluid flow path and configured both to conduct the fluid from the housing to the fluid chamber and to restrain particles in the fluid from entering the fluid chamber. The filter is further configured to define a bubble flow path that facilitates conduction of bubbles from the fluid chamber to the housing. Additional features of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.Type: ApplicationFiled: February 21, 2012Publication date: December 4, 2014Inventors: Arun Agarwal, Paul Richards, Galen Cook