Abstract: Apparatuses, methods, systems, and computer-readable media are provided for maintaining contact information associated with a contact. In some embodiments a request associated with a contact may be received. Contact information may be obtained from one or more external or internal sources. One or more confidence scores may be generated for the obtained contact information and for one or more values received with the request. Based on the confidence score(s), one or more values associated with the contact may be incorporated in one or more data stores. In some embodiments, suggestions for contact related information may be generated or one or more data stores may be automatically updated.

Abstract: Systems and methods are provided for assigning a treatment to a patient is provided. A set of genetic data representing a patient. A polygenic score representing the likelihood that a patient will benefit from intensive glycemia treatment is generated from the set of genetic data.

Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

Abstract: A gate system including at least one post extending from a ground surface and a gate assembly extending from the post. The gate assembly includes at least one gatepost coupled to the post, at least one rail and at least one gate block. The gate block is inserted into the gatepost, and the rail is inserted into the gatepost and the gate block.