Patents by Inventor Galen W. Miller
Galen W. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11923151Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.Type: GrantFiled: January 13, 2021Date of Patent: March 5, 2024Inventors: Galen W. Miller, John Bultitude, Lonnie G. Jones
-
Patent number: 11744018Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.Type: GrantFiled: January 13, 2021Date of Patent: August 29, 2023Assignee: KEMET Electronics CorporationInventors: John Bultitude, Peter Alexandre Blais, James A. Burk, Galen W. Miller, Hunter Hayes, Allen Templeton, Lonnie G. Jones, Mark R. Laps
-
Publication number: 20210241977Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.Type: ApplicationFiled: January 13, 2021Publication date: August 5, 2021Inventors: Galen W. Miller, John Bultitude, Lonnie G. Jones
-
Publication number: 20210227693Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.Type: ApplicationFiled: January 13, 2021Publication date: July 22, 2021Inventors: John Bultitude, Peter Alexandre Blais, James A. Burk, Galen W. Miller, Hunter Hayes, Allen Templeton, Lonnie G. Jones, Mark R. Laps
-
Patent number: 10984955Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.Type: GrantFiled: June 12, 2019Date of Patent: April 20, 2021Assignee: KEMET Electronics CorporationInventors: John Bultitude, John E. McConnell, Galen W. Miller
-
Patent number: 10790094Abstract: A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.Type: GrantFiled: June 28, 2019Date of Patent: September 29, 2020Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
-
Patent number: 10757811Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.Type: GrantFiled: December 6, 2018Date of Patent: August 25, 2020Assignee: KEMET Electronics CorporationInventors: James A. Burk, John Bultitude, Galen W. Miller
-
Patent number: 10681814Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.Type: GrantFiled: September 8, 2017Date of Patent: June 9, 2020Assignee: KEMET Electronics CorporationInventors: John Bultitude, Galen W. Miller, John McConnell
-
Publication number: 20190318877Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elementsType: ApplicationFiled: June 28, 2019Publication date: October 17, 2019Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
-
Publication number: 20190304698Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.Type: ApplicationFiled: June 12, 2019Publication date: October 3, 2019Inventors: John Bultitude, John E. McConnell, Galen W. Miller
-
Patent number: 10381162Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.Type: GrantFiled: August 7, 2017Date of Patent: August 13, 2019Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
-
Patent number: 10366836Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.Type: GrantFiled: October 4, 2016Date of Patent: July 30, 2019Assignee: KEMET Electronics CorporationInventors: John Bultitude, John E. McConnell, Galen W. Miller
-
Publication number: 20190200457Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially.Type: ApplicationFiled: December 6, 2018Publication date: June 27, 2019Inventors: James A. Burk, John Bultitude, Galen W. Miller
-
Publication number: 20190082539Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.Type: ApplicationFiled: September 8, 2017Publication date: March 14, 2019Inventors: John Bultitude, Galen W. Miller, John McConnell
-
Patent number: 10224149Abstract: Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.Type: GrantFiled: September 13, 2016Date of Patent: March 5, 2019Assignee: KEMET Electronics CorporationInventors: Galen W. Miller, John E. McConnell, John Bultitude, Garry L. Renner
-
Publication number: 20170358397Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elementsType: ApplicationFiled: August 7, 2017Publication date: December 14, 2017Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
-
Patent number: 9805872Abstract: An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.Type: GrantFiled: December 9, 2015Date of Patent: October 31, 2017Assignee: KEMET Electronics CorporationInventors: Galen W. Miller, John E. McConnell, John Bultitude, Garry L. Renner
-
Publication number: 20170169955Abstract: An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.Type: ApplicationFiled: December 9, 2015Publication date: June 15, 2017Inventors: Galen W. Miller, John E. McConnell, John Bultitude, Garry L. Renner
-
Publication number: 20170169956Abstract: Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.Type: ApplicationFiled: September 13, 2016Publication date: June 15, 2017Inventors: Galen W. Miller, John E. McConnell, John Bultitude, Garry L. Renner
-
Publication number: 20170025223Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.Type: ApplicationFiled: October 4, 2016Publication date: January 26, 2017Inventors: John Bultitude, John E. McConnell, Galen W. Miller