Patents by Inventor Galle Lin

Galle Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin Wafer Gripper Using High Pressure Air
    Publication number: 20120237329
    Abstract: The invention concerns thin wafer handling for solar silicone wafers or other semiconductor thin wafer handling applications, especially after back grind process. The invention performs high speed, mass wafer transfer between varying pitch carriers. Transfers are between various types of wafer carriers as required (plastic, Teflon, PEEK, SiC, etc.).
    Type: Application
    Filed: March 18, 2011
    Publication date: September 20, 2012
    Inventor: Galle Lin
  • Polar bond head
    Patent number: 5556022
    Abstract: A polar motion bond head for bonding semiconductor devices includes voice coil motors for providing positioning motion to the bond head, and a vision system that has an optical path that allows the camera to see all polar positions with the image staying on the camera centerline.
    Type: Grant
    Filed: June 6, 1994
    Date of Patent: September 17, 1996
    Assignee: Texas Instruments Incorporated
    Inventors: John W. Orcutt, Galle Lin
  • Polar bond head
    Patent number: 5330089
    Abstract: A polar motion bond head for bonding semiconductor devices includes voice coil motors for providing positioning motion to the bond head, and a vision system that has an optical path that allows the camera to see all polar positions with the image staying on the camera centerline.
    Type: Grant
    Filed: November 23, 1992
    Date of Patent: July 19, 1994
    Assignee: Texas Instruments Incorporated
    Inventors: John W. Orcutt, Galle Lin