Patents by Inventor Gam Han YONG
Gam Han YONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230282532Abstract: In one example, a semiconductor device includes a substrate comprising a conductive structure including internal terminals over a substrate first side and external terminals over a substrate second side coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side. An underfill is interposed between the electronic component second side and the substrate first side and is over the guide structure.Type: ApplicationFiled: May 12, 2023Publication date: September 7, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Wang Gu LEE, Gam Han YONG, Ju Hong SHIN, Ji Hun YI
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Patent number: 11688657Abstract: In one example, a semiconductor device includes a substrate having a substrate first side, a substrate second side opposite to the substrate first side, and a conductive structure including internal terminals over the substrate first side; and external terminals over the substrate second side and coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side.Type: GrantFiled: February 10, 2021Date of Patent: June 27, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Wang Gu Lee, Gam Han Yong, Ju Hong Shin, Ji Hun Yi
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Publication number: 20230154893Abstract: A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.Type: ApplicationFiled: January 19, 2023Publication date: May 18, 2023Inventors: David Hiner, Michael Kelly, Ronald Huemoeller, In Su Mok, Sang Hyoun Lee, Won Chul Do, Jin Young Khim, Gam Han Yong, Min Su Jeong, Ji Hun Lee
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Publication number: 20220254694Abstract: In one example, a semiconductor device includes a substrate having a substrate first side, a substrate second side opposite to the substrate first side, and a conductive structure including internal terminals over the substrate first side; and external terminals over the substrate second side and coupled to the internal terminals. An electronic component includes an electronic component first side, an electronic component second side opposite to the electronic component first side, and an electronic component lateral side connecting the electronic component first side to the electronic component second side. The electronic component second side is coupled to one or more of the internal terminals. A guide structure is over the substrate first side and can include an inner portion that is laterally inward from the electronic component lateral side and an outer portion that is laterally outward from the electronic component lateral side.Type: ApplicationFiled: February 10, 2021Publication date: August 11, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Wang Gu LEE, Gam Han YONG, Ju Hong SHIN, Ji Hun YI
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Patent number: 10505073Abstract: A semiconductor light emitting device including a floating conductive pattern is provided. The semiconductor light emitting device includes a first semiconductor layer including a recessed region and a protruding region, an active layer and a second semiconductor layer disposed on the protruding region, a contact structure disposed on the second semiconductor layer, a lower insulating pattern covering the first semiconductor layer and the contact structure, and having first and second openings, a first conductive pattern disposed on the lower insulating pattern and extending into the first opening, a second conductive pattern disposed on the lower insulating pattern and extending into the second opening, and a floating conductive pattern disposed on the lower insulating pattern. The first and second conductive patterns and the floating conductive pattern have the same thickness on the same plane.Type: GrantFiled: October 5, 2017Date of Patent: December 10, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young Kyu Sung, Jae Yoon Kim, Tae Hun Kim, Gam Han Yong, Dong Yeoul Lee, Su Yeol Lee
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Publication number: 20180198022Abstract: A semiconductor light emitting device including a floating conductive pattern is provided. The semiconductor light emitting device includes a first semiconductor layer including a recessed region and a protruding region, an active layer and a second semiconductor layer disposed on the protruding region, a contact structure disposed on the second semiconductor layer, a lower insulating pattern covering the first semiconductor layer and the contact structure, and having first and second openings, a first conductive pattern disposed on the lower insulating pattern and extending into the first opening, a second conductive pattern disposed on the lower insulating pattern and extending into the second opening, and a floating conductive pattern disposed on the lower insulating pattern. The first and second conductive patterns and the floating conductive pattern have the same thickness on the same plane.Type: ApplicationFiled: October 5, 2017Publication date: July 12, 2018Inventors: Young Kyu Sung, Jae Yoon Kim, Tae Hun Kim, Gam Han Yong, Dong Yeoul Lee, Su Yeol Lee
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Patent number: 9887330Abstract: A light-emitting apparatus includes a reflective layer including a cavity that penetrates the reflective layer from a top surface to a bottom surface of the reflective layer; a light-emitting device disposed in the cavity, the light-emitting device including a light-emitting stack and an electrode connected to the light-emitting stack at a bottom surface of the light-emitting stack; and a wavelength conversion layer that fills the cavity and covers a top surface and a side surface of the light-emitting device, wherein the wavelength conversion layer exposes at least a portion of the electrode to an outside.Type: GrantFiled: June 28, 2016Date of Patent: February 6, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hun-yong Park, Sang-hyun Lee, Gam-han Yong, Eui-seok Kim
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Patent number: 9691957Abstract: The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.Type: GrantFiled: May 19, 2015Date of Patent: June 27, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-hyun Lee, Dong-hyuck Kam, Gam-han Yong, Jin-gi Hong, Seong-deok Hwang
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Publication number: 20170012188Abstract: A light-emitting apparatus includes a reflective layer including a cavity that penetrates the reflective layer from a top surface to a bottom surface of the reflective layer; a light-emitting device disposed in the cavity, the light-emitting device including a light-emitting stack and an electrode connected to the light-emitting stack at a bottom surface of the light-emitting stack; and a wavelength conversion layer that fills the cavity and covers a top surface and a side surface of the light-emitting device, wherein the wavelength conversion layer exposes at least a portion of the electrode to an outside.Type: ApplicationFiled: June 28, 2016Publication date: January 12, 2017Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hun-yong PARK, Sang-hyun LEE, Gam-han YONG, Eui-seok KIM
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Publication number: 20150255694Abstract: The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.Type: ApplicationFiled: May 19, 2015Publication date: September 10, 2015Inventors: Sang-hyun LEE, Dong-hyuck KAM, Gam-han YONG, Jin-gi HONG, Seong-deok HWANG
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Patent number: 9065033Abstract: The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.Type: GrantFiled: February 4, 2014Date of Patent: June 23, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-hyun Lee, Dong-hyuck Kam, Gam-han Yong, Jin-gi Hong, Seong-deok Hwang
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Publication number: 20150102373Abstract: There is provided a light emitting diode (LED) package. The LED package includes a package body. The LED package also includes an LED chip mounted on the package body. The LED package further includes a side inclined portion disposed to enclose side surfaces of the LED chip, including a light transmission material and having an upwardly inclined surface. The LED package also includes a wavelength conversion layer disposed on a top surface of the LED chip and the inclined surface of the side inclined portion.Type: ApplicationFiled: June 25, 2014Publication date: April 16, 2015Inventors: Sang Hyun Lee, Dong Hyuck Kam, Yong Tae Kim, Gam Han Yong, Seung Jae Lee, Seong Deok Hwang
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Publication number: 20140239328Abstract: The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.Type: ApplicationFiled: February 4, 2014Publication date: August 28, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-hyun LEE, Dong-hyuck KAM, Gam-han YONG, Jin-gi HONG, Seong-deok HWANG
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Publication number: 20140232293Abstract: The present application provides a light-emitting device package. The light-emitting device package includes a package substrate includes at least one via hole. A light-emitting device is mounted on the package substrate so as to overlap with the via hole. A bonding layer is formed between the light-emitting device and the package substrate and includes a eutectic bonding material.Type: ApplicationFiled: November 18, 2013Publication date: August 21, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-hyuck KAM, Gam-han YONG, Sang-hyun LEE, Seong-deok HWANG
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Publication number: 20130236997Abstract: A light emitting device and a method for fabricating the same are provided. The method includes: forming a plurality of light emitting laminates in which a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially laminated on a growth substrate; mounting the growth substrate on a substrate including a plurality of terminal units each including a pair of electrode terminals; electrically connecting the second conductivity-type semiconductor layer of each of the light emitting laminates to a first electrode terminal of a corresponding terminal unit; removing the growth substrate to expose the first conductivity-type semiconductor layer; forming an insulating layer on a lateral surface of each of the plurality of light emitting laminates; and electrically connecting the exposed first conductivity-type semiconductor layer of each of the light emitting laminates to a second electrode terminal of the corresponding terminal unit.Type: ApplicationFiled: March 8, 2013Publication date: September 12, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Hyun LEE, Gam Han YONG, Seong Deok HWANG