Patents by Inventor Gamal M. Hegazi

Gamal M. Hegazi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8963636
    Abstract: A high efficiency outphasing power amplifier is disclosed which provides a high-efficiency, high-linearity outphasing amplifier capable of amplifying complex, wideband, multi-tone signals. Systems herein may amplify at least 256 symbol QAM signals with negligible distortion, while achieving high direct current-to-radio frequency efficiency sustainable at virtually all power levels. Embodiments of the outphasing amplifier employ a bridge output network formed from two complementary Class-D amplifiers to switch a dc supply voltage across the load. In embodiments, the phase of both halves of the bridge is varied from zero to +/?90 or zero to 180 degrees to split the workload, to correct for phase error within the bridge network and to control output power. Because the current through the load and thus through the two halves of the amplifier vary directly with output level, the efficiency remains high even when power output is low.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: February 24, 2015
    Assignee: Rockwell Collins, Inc.
    Inventors: David L. Krett, Timothy L. Kean, Gamal M. Hegazi, David W. Rowland
  • Patent number: 8395458
    Abstract: The present invention is a high power direct transmitter with frequency-shift keying (FSK) modulation. The transmitter implements a high power, high efficiency power voltage-controlled oscillator (VCO) which allows for production of a modulated RF signal at the final stage (ex.—right at the antenna), thereby eliminating all driving stage power amplification and frequency translation. The transmitter further provides a low SWAP-C alternative to currently available solutions.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: March 12, 2013
    Assignee: Rockwell Collins, Inc.
    Inventors: Chenggang Xie, Gamal M. Hegazi
  • Patent number: 7859337
    Abstract: A Class-D amplifier having a wideband driver circuit including a first transmission line transformer and a second transmission line transformer. An input of the first transmission line transformer is approximately 180 degrees out of phase from an input of the second transformer. A first transistor (Q1) has an input operatively connected to the first transmission line transformer. A second transistor (Q2) has an input being operatively connected to the second transmission line transformer. The first and the second transmission line transformers cooperate to provide a signal of sufficient magnitude to saturate their associated power transistors in the ON mode and to cut them off in the OFF mode with very small rise and fall transit times, thus providing high efficiency.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: December 28, 2010
    Assignee: Rockwell Collins, Inc,
    Inventors: Thanh D. Chu, Scott L. Heibel, Gamal M. Hegazi
  • Patent number: 5416971
    Abstract: A monolithic gallium arsenide (GaAs) phased array using integrated gold (Au) posts for interconnecting multiple substrate layers. The phased array includes a GaAs substrate having transmit/receive modules fabricated on one side and radiating elements etched on the backside of the same substrate. The conductive gold posts are integrated on the same side with the transmit/receive modules and interconnect the transmit/receive modules with a distribution network which is printed on a second substrate. Gold posts are also used to interconnect DC bias and control lines of the two substrates.
    Type: Grant
    Filed: July 28, 1993
    Date of Patent: May 23, 1995
    Inventors: Gamal M. Hegazi, Krishna P. Pande, Amin Ezzeddine, Robert Sorbello, Bernard Geller
  • Patent number: 5262794
    Abstract: A monolithic gallium arsenide (GaAs) phased array using integrated gold (Au) posts for interconnecting multiple substrate layers. The phased array includes a GaAs substrate having transmit/receive modules fabricated on one side and radiating elements etched on the backside of the same substrate. The conductive gold posts are integrated on the same side with the transmit/receive modules and interconnect the transmit/receive modules with a distribution network which is printed on a second substrate. Gold posts are also used to interconnect DC bias and control lines of the two substrates.
    Type: Grant
    Filed: July 18, 1991
    Date of Patent: November 16, 1993
    Assignee: Communications Satellite Corporation
    Inventors: Gamal M. Hegazi, Krishna P. Pande, Amin Ezzeddine, Robert Sorbello, Bernard Geller