Patents by Inventor Gan-how SHAUE

Gan-how SHAUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9379089
    Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 28, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-kuang Yang, Cheng-yi Chang, Yeong-yan Guu, Gan-how Shaue
  • Patent number: 9256209
    Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: February 9, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-Kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
  • Patent number: 9223296
    Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: December 29, 2015
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
  • Patent number: 9182443
    Abstract: Disclosed are a testing device and a testing method thereof. The testing device includes a frame, a flexible multi-layer substrate and at least one electrical testing point. The frame is positioned corresponding to a chip. At least one electrical connecting point is formed on a surface of the chip. The flexible multi-layer substrate is fixed in the frame. The electrical testing point is corresponding to the electrical connecting point and formed on an upper surface of the flexible multi-layer substrate for contacting the electrical connecting point and performing an electrical test to the chip. Furthermore, the electrical connecting point or the electrical testing point is a bump.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: November 10, 2015
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Gan-how Shaue, Chih-kuang Yang
  • Publication number: 20140328148
    Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.
    Type: Application
    Filed: February 24, 2014
    Publication date: November 6, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-Kuang YANG, Yeong-yan GUU, Cheng-yi CHANG, Gan-how SHAUE
  • Publication number: 20140328147
    Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.
    Type: Application
    Filed: February 24, 2014
    Publication date: November 6, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-kuang YANG, Yeong-yan GUU, Cheng-yi CHANG, Gan-how SHAUE
  • Publication number: 20140312490
    Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.
    Type: Application
    Filed: January 23, 2014
    Publication date: October 23, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-kuang YANG, Cheng-yi CHANG, Yeong-yan GUU, Gan-how SHAUE
  • Publication number: 20140167255
    Abstract: Disclosed are a package structure and a package method. The package structure comprises an IC bare die, having bare die pads formed on a surface; a flexible packaging substrate, having first pads formed on a first surface and second pads formed on a second surface; and a plurality of bumps, previously formed on the first surface of the flexible packaging substrate. The bumps have different heights, and correspond to the first pads and contact the bare die pads respectively. Pressing or heating is implemented to package the IC bare die. The package structure further comprises a printed circuit board, having a plurality of contact pads. The second pads of the flexible packaging substrate respectively contact with the contact pads via solders. Connection is implemented by pressing or heating. Extremely low stress is generated to the packaging substrate and the printed circuit board.
    Type: Application
    Filed: November 13, 2013
    Publication date: June 19, 2014
    Applicant: PRINCO MIDDLE EAST FZE
    Inventors: Gan-how SHAUE, Chih-kuang YANG, Yeong-yan GUU
  • Publication number: 20140167803
    Abstract: Disclosed are a testing device and a testing method thereof. The testing device includes a frame, a flexible multi-layer substrate and at least one electrical testing point. The frame is positioned corresponding to a chip. At least one electrical connecting point is formed on a surface of the chip. The flexible multi-layer substrate is fixed in the frame. The electrical testing point is corresponding to the electrical connecting point and formed on an upper surface of the flexible multi-layer substrate for contacting the electrical connecting point and performing an electrical test to the chip. Furthermore, the electrical connecting point or the electrical testing point is a bump.
    Type: Application
    Filed: November 13, 2013
    Publication date: June 19, 2014
    Inventors: Gan-how SHAUE, Chih-kuang YANG