Patents by Inventor Ganesh R. Chavan

Ganesh R. Chavan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Harness assembly
    Patent number: 11646129
    Abstract: A harness assembly may include a cable having a cable shielding around at least a portion of a plurality of wires, a connector with an integrated backshell arranged at an angle with respect to the cable, an external braid disposed around at least a portion of the backshell and the cable, and an overbraid around at least a portion of the external braid, the overbraid having two layers.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: May 9, 2023
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Michael J. Schneider, Sam Spiegel, James H. Le, Ganesh R. Chavan
  • Harness assembly
    Patent number: 11515061
    Abstract: A harness assembly may include a cable having a cable shielding around at least a portion of a plurality of wires, a connector with an integrated backshell arranged at an angle with respect to the cable, an external braid disposed around at least a portion of the backshell and the cable, and an overbraid around at least a portion of the external braid, the overbraid having two layers.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: November 29, 2022
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Michael J. Schneider, Sam Spiegel, James H. Le, Ganesh R. Chavan
  • HARNESS ASSEMBLY
    Publication number: 20210098150
    Abstract: A harness assembly may include a cable having a cable shielding around at least a portion of a plurality of wires, a connector with an integrated backshell arranged at an angle with respect to the cable, an external braid disposed around at least a portion of the backshell and the cable, and an overbraid around at least a portion of the external braid, the overbraid having two layers.
    Type: Application
    Filed: September 28, 2020
    Publication date: April 1, 2021
    Inventors: Michael J. Schneider, Sam Spiegel, James H. Le, Ganesh R. Chavan