Patents by Inventor Ganesh Subbarayan

Ganesh Subbarayan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8518304
    Abstract: The present invention features additions of nanostructures to interconnect conductor particles to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nanostructures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: August 27, 2013
    Assignee: The Research Foundation of State University of New York
    Inventors: Bahgat Sammakia, Wayne E. Jones, Jr., Ganesh Subbarayan
  • Patent number: 8173260
    Abstract: The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: May 8, 2012
    Assignee: The Research Foundation of State University of New York
    Inventors: Bahgat Sammakia, Wayne E. Jones, Ganesh Subbarayan
  • Patent number: 7645512
    Abstract: The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: January 12, 2010
    Assignee: The Research Foundation of the State University of New York
    Inventors: Bahgat Sammakia, Wayne E. Jones, Jr., Ganesh Subbarayan
  • Patent number: 6484613
    Abstract: A method of punching a via or through hole in a polymer-metal laminate workpiece in a punch press. The punch press has a punch tool, a driver coil for driving the punch tool through the polymer-metal laminate workpiece, and a stopper for stopping the punch travel of the punch tool and mechanically returning the punch tool to its starting position. The method includes the steps of applying an electrical current pulse through the driver coil to electromagnetically drive the punch downward to and through the workpiece, and then elastically colliding the punch tool with the stopper to stop and return the punch tool on an upward return stroke. Subsequently a second, braking pulse is applied through the driver coil to electromagnetically brake the punch. The second electrical current is applied after the start of the punching pulse, for a time and magnitude sufficient to brake the punch press.
    Type: Grant
    Filed: May 12, 1995
    Date of Patent: November 26, 2002
    Assignee: International Business Machines Corporation
    Inventors: Ho Chong Lee, Ganesh Subbarayan, Paul Gerard Wilkin
  • Patent number: 6480299
    Abstract: A color management method/apparatus generates image color matching and International Color Consortium (ICC) color printer profiles using a reduced number of color patch measurements. Color printer characterization, and the generation of ICC profiles usually require a large number of measured data points or color patches and complex interpolation techniques. This invention provides an optimization method/apparatus for performing LAB to CMYK color space conversion, gamut mapping, and gray component replacement. A gamut trained network architecture performs LAB to CMYK color space conversion to generate a color profile lookup table for a color printer, or alternatively, to directly control the color printer in accordance with the a plurality of color patches that accurately. represent the gamut of the color printer.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: November 12, 2002
    Assignee: University Technology Corporation
    Inventors: Paul Apostolos Drakopoulos, Ganesh Subbarayan