Abstract: A test system for testing an integrated circuit package is provided. The test system may include a test board on which a package under test can be mounted, a test box for gathering desired measurements on the package under test, and a test host for automatically controlling the test box during testing. The test box may be coupled to row multiplexing circuitry and column multiplexing circuitry for selectively addressing one or more daisy-chained nets in the package under test. The test box may also be coupled to a source measurement unit (SMU) component that provides current source signals to the package under test and to a digital multimeter (DMM) component that provides voltage sense signals to the package under test. Arranged in this way, the test system can be configured to perform automated I-V curve tracing, resistance measurements, open/short circuit detection, and monitoring of other package-level manufacturing defects.