Patents by Inventor Gang Feng
Gang Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250113605Abstract: A method for fabricating a radio-frequency (RF) device includes the steps of first providing a substrate comprising a core region and a non-core region, forming a shallow trench isolation (STI) in the substrate between the core region and the non-core region, forming a first gate oxide layer on the core region and the non-core region, forming a patterned mask on the non-core region and the STI, removing the first gate oxide layer on the core region, and then forming a second gate oxide layer on the core region.Type: ApplicationFiled: October 30, 2023Publication date: April 3, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Wan-Tien Chou, Gang Ren, Xingxing Chen, Ji Feng, Guohai Zhang
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Publication number: 20250112085Abstract: An apparatus is provided which comprises: a plurality of interconnect layers within a substrate, organic dielectric material over the plurality of interconnect layers, copper pads on a surface of a cavity within the organic dielectric material, an integrated circuit bridge device coupled with the copper pads, wherein a surface of the integrated circuit bridge device is elevated above an opening of the cavity, underfill material between the integrated circuit bridge device and the surface of the cavity, and build-up layers formed over the organic dielectric material around the integrated circuit bridge device. Other embodiments are also disclosed and claimed.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Intel CorporationInventors: Bohan Shan, Ziyin Lin, Haobo Chen, Yiqun Bai, Kyle Arrington, Jose Waimin, Ryan Carrazzone, Hongxia Feng, Dingying Xu, Srinivas Pietambaram, Minglu Liu, Seyyed Yahya Mousavi, Xinyu Li, Gang Duan, Wei Li, Bin Mu, Mohit Gupta, Jeremy Ecton, Brandon C. Marin, Xiaoying Guo, Ashay Dani
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Publication number: 20250112136Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Bohan SHAN, Jesse JONES, Zhixin XIE, Bai NIE, Shaojiang CHEN, Joshua STACEY, Mitchell PAGE, Brandon C. MARIN, Jeremy D. ECTON, Nicholas S. HAEHN, Astitva TRIPATHI, Yuqin LI, Edvin CETEGEN, Jason M. GAMBA, Jacob VEHONSKY, Jianyong MO, Makoyi WATSON, Shripad GOKHALE, Mine KAYA, Kartik SRINIVASAN, Haobo CHEN, Ziyin LIN, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Hiroki TANAKA, Ashay DANI, Praveen SREERAMAGIRI, Yi LI, Ibrahim EL KHATIB, Aaron GARELICK, Robin MCREE, Hassan AJAMI, Yekan WANG, Andrew JIMENEZ, Jung Kyu HAN, Hanyu SONG, Yonggang Yong LI, Mahdi MOHAMMADIGHALENI, Whitney BRYKS, Shuqi LAI, Jieying KONG, Thomas HEATON, Dilan SENEVIRATNE, Yiqun BAI, Bin MU, Mohit GUPTA, Xiaoying GUO
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Publication number: 20250112164Abstract: A device comprises a substrate comprising a plurality of build-up layers and a cavity. A bridge die is located within the cavity and a plurality of cavity side bumps are on one side of the bridge die. A plurality of interconnect pads with variable heights are on one of the build-up layers of the substrate coupled to the plurality of the cavity side bumps to bond the bridge die to the substrate.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Bohan SHAN, Onur OZKAN, Ryan CARRAZZONE, Rui ZHANG, Haobo CHEN, Ziyin LIN, Yiqun BAI, Kyle ARRINGTON, Jose WAIMIN, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Bin MU, Mohit GUPTA, Jeremy D. ECTON, Brandon C. MARIN, Xiaoying GUO, Steve S. CHO, Ali LEHAF, Venkata Rajesh SARANAM, Shripad GOKHALE, Kartik SRINIVASAN, Edvin CETEGEN, Mine KAYA, Nicholas S. HAEHN, Deniz TURAN
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Publication number: 20250112124Abstract: DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING An electronic package, comprises a substrate core; dielectric material of one or more dielectric material layers over the substrate core, and having a plurality of metallization layers comprising an upper-most metallization layer; and an integrated circuit (IC) die embedded within the dielectric material and below the upper-most metallization layer. The package also has a metallization pattern within the dielectric material and below the IC die; and a gap within the dielectric material and extending around the metallization pattern.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: Intel CorporationInventors: Jeremy Ecton, Aleksandar Aleksov, Leonel Arana, Gang Duan, Benjamin Duong, Hongxia Feng, Tarek Ibrahim, Brandon C. Marin, Tchefor Ndukum, Bai Nie, Srinivas Pietambaram, Bohan Shan, Matthew Tingey
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Publication number: 20250106983Abstract: Embodiments disclosed herein include glass core package substrates with a stiffener. In an embodiment, an apparatus comprises a substrate with a first layer with a first width, where the first layer is a glass layer, a second layer under the first layer, where the second layer has a second width that is smaller than the first width, and a third layer over the first layer, where the third layer has a third width that is smaller than the first width. In an embodiment, the apparatus further comprises a metallic structure with a first portion and a second portion, where the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Inventors: Bohan SHAN, Kyle ARRINGTON, Dingying David XU, Ziyin LIN, Timothy GOSSELIN, Elah BOZORG-GRAYELI, Aravindha ANTONISWAMY, Wei LI, Haobo CHEN, Yiqun BAI, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Bin MU, Mohit GUPTA, Jeremy D. ECTON, Brandon C. MARIN, Xiaoying GUO, Ashay DANI
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Publication number: 20250105074Abstract: Glass cores including protruding through glass vias and related methods are disclosed herein. An example substrate disclosed herein includes a glass core including a surface and a copper through glass via (TGV) extending through the glass core, the TGV including a protrusion extending from the surface.Type: ApplicationFiled: December 11, 2024Publication date: March 27, 2025Applicant: Intel CorporationInventors: Bohan Shan, Haobo Chen, Wei Wei, Jose Fernando Waimin Almendares, Ryan Joseph Carrazzone, Kyle Jordan Arrington, Ziyin Lin, Dingying Xu, Hongxia Feng, Yiqun Bai, Hiroki Tanaka, Brandon Christian Marin, Jeremy Ecton, Benjamin Taylor Duong, Gang Duan, Srinivas Venkata Ramanuja Pietambaram, Rui Zhang, Mohit Gupta
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Patent number: 12261771Abstract: The disclosed apparatuses and methods are directed to data plane restoration in a network. A method comprises receiving a label-switched path (LSP) failure notification indicating a failure in a network; generating, by a node of the network, a fast-restoration (FR) message and transmitting the FR message to a second node of the message forwarding path. The FR message comprises: a plurality of forwarding instruction objects (FIOs) having forwarding instructions for the FR message for each node of a message forwarding path; and a plurality of label-switched path objects (LSPOs) having a restoration LSP data for each node of a protection detour path. Another method comprises receiving the FR message; generating a modified FR message based on the FR message; and transmitting the modified FR message to another node of the message forwarding path based on the FIO, prior to processing the FR message by the node.Type: GrantFiled: March 28, 2022Date of Patent: March 25, 2025Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yixiao Chen, Haoyu Feng, Kaixuan Yang, Gang Xie, Hao Li
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Publication number: 20250072342Abstract: A method for cultivating alcohol-brewing sorghum on the basis of a biodegradable mulching film includes five steps such as farmland preparation, film mulching, sowing operation, field management and harvesting. Compared with a traditional alcohol-brewing sorghum planting method, the method of the present invention can effectively bring forward the planting time of alcohol-brewing sorghum, reduce the sowing amount of alcohol-brewing sorghum, assist in increasing the germination rate of alcohol-brewing sorghum, and promote the growth and development of alcohol-brewing sorghum; moreover, the method of the present invention effectively reduces the labor intensity and cost of a weeding operation in field management.Type: ApplicationFiled: September 30, 2022Publication date: March 6, 2025Applicant: JIANGSU ACADEMY OF AGRICULTURAL SCIENCESInventors: Lei XU, Min WANG, Gang CHEN, Nina YAN, Xizhi JIANG, Jingwen CHEN, Jie PI, Jun LIU, Hongde XIE, Min FENG
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Publication number: 20250051321Abstract: Disclosed are a tricyclic derivative and a preparation method therefor and an application thereof. Specifically, disclosed are a compound shown in formula (I) and an optical isomer thereof or a pharmaceutically acceptable salt thereof, and an application of the compound as an Autotaxin inhibitor.Type: ApplicationFiled: November 25, 2022Publication date: February 13, 2025Applicant: SHANGHAI JEMINCARE PHARMACEUTICAL CO., LTD.Inventors: Gang DENG, Shuchun GUO, Jun FAN, Zhitao ZHANG, Nan WU, Wenqiang SHI, Zhihua FANG, Jianbo FENG, Jianbiao PENG, Haibing GUO
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Patent number: 12217503Abstract: The provided is a tidal flat extraction method based on hyperspectral data. The method includes: acquiring and preprocessing hyperspectral data; calculating a constraint condition; calculating, according to the constraint condition, a normalized difference tidal flat index (NDTFI), generating a sample index statistical box chart, and determining a tidal flat extraction threshold according to the sample index statistical box chart; and removing a misclassified pixel based on a coastal buffer zone and a high spatial resolution image, thereby achieving final extraction of a tidal flat. The method has the following beneficial effects. The method is an effective supplement to the existing tidal flat extraction methods. The method adopts an easily realized process, improves the accuracy of tidal flat extraction, reflects the real spatial distribution of the tidal flat, and provides a scientific basis for tidal flat management and protection.Type: GrantFiled: August 19, 2024Date of Patent: February 4, 2025Assignee: NINGBO UNIVERSITYInventors: Gang Yang, Weiwei Sun, Chunchen Shao, Xiangchao Meng, Tian Feng
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Patent number: 12213732Abstract: Methods, systems, and devices are provided for assessing visual function, especially in animals. For example, a device can be used for assessing visual functions, such as PLR and OMR, in animals that includes a visual stimulus unit. The device can also include one or more input devices that include at least one camera that is configured to monitor movement of the test subject and a processor that is configured to analyze the movement of the test subject taken by the camera and to assess visual functions of the test subject. The device can be used in a system including a designated general location for the test subject in which the test subject can see the visual stimulus unit and move freely while being monitored by the camera.Type: GrantFiled: April 3, 2019Date of Patent: February 4, 2025Assignee: The Schepens Eye Research Institute, Inc.Inventors: Dong Feng Chen, Gang Luo, Cong Shi, Kin-Sang Cho
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METHOD FOR IMPROVING SHUNTING ROUTE SETTING OF CENTRALIZED TRAFFIC CONTROL SYSTEM, DEVICE AND MEDIUM
Publication number: 20250033681Abstract: The invention relates to a method for improving shunting route setting of a centralized traffic control system, a device and a medium. The method comprises the following steps: S1, acquiring a shunting operation plan from an interface of a SMIS and generating a shunting route sequence, by a centralized traffic control system; S2, adding an operation direction, a location identifier of a shunter, a current control mode of the shunter and a description of a next route based on an original shunter number of the centralized traffic control system; S3, configuring a manual setting mode and an automatic triggering mode for shunting route setting; S4, adding identifiers of the manual setting mode and the automatic triggering mode to shunter number display; S5, in the manual setting mode, adding a shunting plan constraint state and a free setting state to a shunting route setting logic of the centralized traffic control system; and the like.Type: ApplicationFiled: November 29, 2022Publication date: January 30, 2025Inventors: Fan CHEN, Baowei TANG, Ruyue WANG, Gang WANG, Yuehua ZHAI, Zhenguo FENG -
Patent number: 12203977Abstract: Disclosed are a power-loss delay circuit and a detection control circuit thereof. The power-loss delay circuit and the corresponding detection control circuit are added onto a flyback circuit. When a product is working normally, an energy storage capacitor is charged, and when an input power supply of the product is cut off, the detection control circuit detects that an input voltage of the product drops to a set value and triggers the control circuit to drive a switch transistor to be turned on, so that the energy of an energy storage capacitor is released, thereby keeping the product working continuously for a period of time. The power-loss delay circuit and the detection control circuit thereof have no effect on the normal working state of the product. When the input power is cut off, capacitance stored in an external capacitor is introduced in time to keep the product working continuously.Type: GrantFiled: December 29, 2021Date of Patent: January 21, 2025Assignee: MORNSUN GUANGZHOU SCIENCE & TECHNOLOGY CO., LTD.Inventors: Mengyang Xu, Dongsheng Lan, Gang Feng
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Publication number: 20250020738Abstract: Systems and methods for automatic magnetic variation detection include receiving, from a magnetic variation database, first magnetic variation data associated with an airport; determining second magnetic variation data based on a published approach associated with the airport and one or more trajectory measurements as an aircraft flies along a centerline of a localizer signal of the airport; determining a difference between the first magnetic variation data and the second magnetic variation data; and if the difference satisfies a deviation threshold, updating the magnetic variation database based at least on the second magnetic variation data.Type: ApplicationFiled: July 11, 2023Publication date: January 16, 2025Inventors: Ethan Sit, Geun I. Kim, Gang Feng, Theresa J. Hirsch
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Publication number: 20240310277Abstract: An optical measurement system measurement system for examining a sample. The measurement system comprises an internally reflective element, a stage, an optical assembly, a chassis, and a sensor. The internally reflective element has a contact surface. The stage is positioned below the internally reflective element. The stage and the internally reflective element are configured to apply a force to the sample. The optical assembly comprises a light source and a light detector. The optical assembly is configured to scan the sample by directing source light from the light source towards the contact surface and detecting source light optically interacting with the contact surface by the light detector. The chassis is configured to support the optical assembly and the internally reflective element. The sensor is mounted to the chassis and configured to detect the force applied to the sample by the internally reflective element and the stage.Type: ApplicationFiled: May 20, 2024Publication date: September 19, 2024Inventors: William Robert KEEFE, Gang FENG, Min YAN, William BAYER, Peter STEINBERG
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Patent number: 12019014Abstract: An optical measurement system measurement system for examining a sample. The measurement system comprises an internally reflective element, a stage, an optical assembly, a chassis, and a sensor. The internally reflective element has a contact surface. The stage is positioned below the internally reflective element. The stage and the internally reflective element are configured to apply a force to the sample. The optical assembly comprises a light source and a light detector. The optical assembly is configured to scan the sample by directing source light from the light source towards the contact surface and detecting source light optically interacting with the contact surface by the light detector. The chassis is configured to support the optical assembly and the internally reflective element. The sensor is mounted to the chassis and configured to detect the force applied to the sample by the internally reflective element and the stage.Type: GrantFiled: July 14, 2022Date of Patent: June 25, 2024Assignee: Thermo Electron Scientific Instruments LLCInventors: William Robert Keefe, Gang Feng, Min Yan, William Bayer, Peter Steinberg
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Publication number: 20240088594Abstract: The present application provides a cable connector and an electronic device. The cable connector includes a socket and a plug; the socket is provided with an opening and a connection part for connecting with a circuit board; the plug includes a fixing member and an elastic connection member; the elastic connection member each includes a fixing part and a first elastic contact part connected with the fixing part, the fixing part being fixedly connected with the fixing member for connecting with an inner conductor of the cable; the fixing member is capable of connecting with the socket, and enables the first elastic contact part to elastically contact a signal connection contact on the circuit board through the opening to form electrical connection.Type: ApplicationFiled: January 22, 2021Publication date: March 14, 2024Applicant: Zhuhai LinkE Technology Co., Ltd.Inventors: Gang Feng, Changming Wu, Yihong Qi, Wei YU
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Patent number: 11841922Abstract: Method and system for classifying and labeling images, which can perform segmentation based on features of each part of images, classify and match the image and the segmented image based on a classification model built by the machine learning method. Meanwhile, each image is assigned with labels and text descriptions. The system also includes a string module assigning the image with a plurality of matching labels and text descriptions that are the most relevant in recent times. Furthermore, the classification model is trained by machine learning method such as an unsupervised learning, a self-supervised learning, or a heuristic algorithms. In addition, a character recognition module is provided to extract characters in the image for comprehensive learning and calculations to facilitate classification and labeling of the image.Type: GrantFiled: May 25, 2021Date of Patent: December 12, 2023Assignee: AWOO INTELLIGENCE, INC.Inventors: Szu-Wu Lin, Gang-Feng Ho, Kuo Ming Lin
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Publication number: 20230367913Abstract: The present disclosure relates to a terminal chip and a measurement method thereof. In an example, a terminal chip includes a computing subsystem and a security subsystem. The security subsystem is configured to measure the computing subsystem. A boot time of the security subsystem is earlier than a boot time of the computing subsystem. The security subsystem includes an integrity verification unit configured to perform integrity measurement on data in a boot process of the computing subsystem.Type: ApplicationFiled: July 21, 2023Publication date: November 16, 2023Inventors: Jianwei JIA, Feifei YIN, Gang FENG, Yu LIU