Abstract: A protective case configured to cover a portable electronic device is provided. The protective case may include a first card storage configured to receive a first card, and a second card storage configured to store a second card where the second card storage is spaced apart from the first card storage.

Abstract: A method for controlling continuously variable valve timing (CVVT), may include determining whether a CVVT control is started, detecting a position of a cam and a position of a crankshaft when the CVVT control is started, determining whether the cam is positioned at a locking position based on the positions of the cam and crankshaft, determining whether the cam is controlled to be positioned from the locking position to an advancing position or a holding position, when the cam is positioned at the locking position, and when the cam is controlled to be positioned from the locking position to the advancing position or the holding position and when a condition for performing the CVVT control is satisfied, determining whether a cam torque is negative and performing predetermined CVVT control after waiting a predetermined time when the cam torque is negative.

Abstract: A continuously variable valve timing device is provided and includes a cam sprocket connected with a camshaft having a plurality of cams to rotate the camshaft and an electric variable valve timing mechanism connected with the cam sprocket, and driven by an electric motor. A chain cover protects the cam sprocket and a chain system from foreign substances and an electric variable valve timing mechanism cover protects the electric variable valve timing mechanism from foreign substances. A seal ring partitions an internal space between the electric variable valve timing mechanism and the electric variable valve timing mechanism cover. In addition, a pressure maintaining device is mounted within the electric variable valve timing mechanism cover to maintain pressure formed within the internal space of the electric variable valve timing mechanism cover at about atmospheric pressure.

Abstract: A continuously variable valve timing device is provided and includes a cam sprocket connected with a camshaft having a plurality of cams to rotate the camshaft and an electric variable valve timing mechanism connected with the cam sprocket, and driven by an electric motor. A chain cover protects the cam sprocket and a chain system from foreign substances and an electric variable valve timing mechanism cover protects the electric variable valve timing mechanism from foreign substances. A seal ring partitions an internal space between the electric variable valve timing mechanism and the electric variable valve timing mechanism cover. In addition, a pressure maintaining device is mounted within the electric variable valve timing mechanism cover to maintain pressure formed within the internal space of the electric variable valve timing mechanism cover at about atmospheric pressure.

Abstract: A variable valve lift apparatus may include a camshaft, a cam piece having first cams having lift amounts that are different formed at one side thereof, a first cam protrusion portion formed near the first cams that is slidably disposed on the camshaft to rotate with the camshaft, a first guide pin that protrudes on one side of an exterior circumference of the first cam protrusion portion, a first guide that is disposed to correspond to the first cam protrusion portion and in which a first guide groove is formed thereon to move the first cam piece in one direction along the camshaft according to the rotation of the first guide pin, and a first operation portion that moves the first guide toward the first cam protrusion portion such that the first guide pin is inserted into the first guide groove of the first guide.

Abstract: A variable valve lift apparatus may include a camshaft, a cam piece having first cams having lift amounts that are different formed at one side thereof, a first cam protrusion portion formed near the first cams that is slidably disposed on the camshaft to rotate with the camshaft, a first guide pin that protrudes on one side of an exterior circumference of the first cam protrusion portion, a first guide that is disposed to correspond to the first cam protrusion portion and in which a first guide groove is formed thereon to move the first cam piece in one direction along the camshaft according to the rotation of the first guide pin, and a first operation portion that moves the first guide toward the first cam protrusion portion such that the first guide pin is inserted into the first guide groove of the first guide.

Abstract: Provided is a solar cell, including: a semiconductor substrate having a p-n junction; an antireflection film formed on at least one side of the semiconductor substrate; first electrodes formed on the antireflection film; and second electrodes covering the first electrodes, wherein only the first electrodes selectively penetrate the antireflection film and is thus connected with the semiconductor substrate by a punch through process.

Abstract: Provided are a solar cell and a method for manufacturing the same, and more particularly, a solar cell for forming a selective emitter structure and a surface texture using dry plasma etching at the same time, and a method for manufacturing the same. The solar cell includes a silicon semiconductor substrate; an emitter doping layer having a surface, which is textured by a texturing process on an upper portion of the silicon semiconductor substrate and selectively doped; an anti-reflective film layer formed on a front of the substrate; a front electrode accessing to the emitter doping layer by penetrating the anti-reflective film layer; and a rear electrode accessing to a rear of the silicon semiconductor substrate.

Abstract: Provided is a method of manufacturing a solar cell, wherein a solar cell is manufactured by combining a damage removal etching process, a texturing process and an edge isolation process. The method is advantageous in that RIE and DRE are conducted, and then DRE/PSG and/or an edge isolation removal process are simultaneously conducted, so that the movement of a substrate (that is, a wafer) is minimized, thereby reducing the damage rate of the substrate.