Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die, and an array of pillars adjacent to the die. In an embodiment, the electronic package further comprises an underfill under the die, where an edge of the underfill is between an inner column of pillars in the array of pillars and an outer edge of the die, and where the edge of the underfill has a height that is less than a maximum height of the underfill.

Abstract: A tizanidine liquid preparation and use of the tizanidine liquid preparation in the preparation of a medicament for treating muscle spasm, wherein the tizanidine liquid preparation comprises an active ingredient, disodium EDTA and other pharmaceutical excipients, wherein the active ingredient is one or more of tizanidine or a pharmaceutically acceptable salt, solvate and hydrate thereof.

Abstract: Provided are an adhesive tape attaching device for cell and a manufacturing method for the adhesive tape attaching device for cell. The adhesive tape attaching device for cell includes a tooling plate, an adhesive tape clamping and pulling mechanism, an adhesive tape cutting mechanism, an adhesive tape attaching mechanism, and a driving mechanism. The tooling plate is for carrying a cell; the adhesive tape clamping and pulling mechanism is configured to clamp an adhesive tape and drive the adhesive tape to move in a horizontal direction approaching the cell; the adhesive tape cutting mechanism is disposed in a transportation direction of the adhesive tape, the adhesive tape cutting mechanism is located upstream of the tooling plate, and the adhesive tape cutting mechanism is configured to cut the adhesive tape into adhesive tape segments; the adhesive tape attaching mechanism is configured to attach the adhesive tape segment onto a to-be-attached region.

Abstract: Embodiments of the present application provide a feeding device for loading a material into a container, which relates to the technical field of product assembly. The feeding device is configured to load a material into a container having an opening. The feeding device includes a pressing unit. The pressing unit includes a pressing member having a pressing plane, and a driving member configured to drive the pressing member to move cyclically along a closed track. The closed track includes a first planar track segment, and when the pressing member moves along the first planar track segment, the pressing plane forms surface contact with the material and keeps extending in a material loading direction, the material loading direction being a movement direction of the material relative to the container. The feeding device can reduce damage to the material during a feeding process.

Abstract: A laterally diffused metal oxide semiconductor device and a preparation method thereof are disclosed. The semiconductor device includes: a substrate; a body region having a first conductivity type and formed in the substrate; a drift region, having a second conductivity type, formed in the substrate and adjacent to the body region; a field plate structure, formed on the drift region, a lower surface of an end of the field plate structure close to the body region being flush with the upper surface of the substrate, and the end of the field plate structure close to the body region also having an upwardly extending inclined surface; and a drain region, having a second conductivity type, formed in an upper layer of the drift region, and in contact with the end of the field plate structure away from the body region.

Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member, a signal feeding via and a plurality of conductive vias. The substrate has opposite first and second surfaces and comprises liquid crystal polymer. The reflective plates are arrayed on the first surface of the substrate. The grounding plate is disposed on the second surface of the substrate and overlapped with the reflective plates in a normal direction of the substrate. The grounding plate further includes an opening. The radiating member is disposed on the first surface of the substrate and physically separated from the reflective plates. The signal feeding via is coupled with the radiating member and penetrates through the substrate to be exposed in the opening of the grounding plate. The conductive vias penetrate through the substrate and respectively connect the reflective plates and the grounding plate.

Abstract: A method in one embodiment creates a model of an authentic IC for use in comparisons with counterfeit ICs. The model can be created by determining a first or initial set of points of interest (POIs) on the simulated physical (e.g., gate level) layout and simulating side channel leakage from each POI and then expanding the size of the POI and repeating the simulation and comparing successive simulation results (between successive sizes of POIs for a given POI) to determine if a solution for the size of the POI has converged. The final POIs are then processed in a simulation that can use multiple payloads (e.g., cryptographic data) over the entire set of final POIs, and the resulting data set can be used to create the model.

Abstract: A system and methods of forming a dielectric material within a trench are described herein. In an embodiment of the method, the method includes introducing a first precursor into a trench of a dielectric layer, such that portions of the first precursor react with the dielectric layer and attach on sidewalls of the trench. The method further includes partially etching portions of the first precursor on the sidewalls of the trench to expose upper portions of the sidewalls of the trench. The method further includes introducing a second precursor into the trench, such that portions of the second precursor react with the remaining portions of the first precursor to form the dielectric material at the bottom of the trench.

Abstract: A road structure reconstructed from large-scale independent underground garage and a construction method, which solves the problem of a newly constructed urban expressway passing through large underground space. The technical point is a construction method for the road structure reconstructed from large-scale independent underground garage, including the following steps: S100: segmentation for the garage, S200: preparation before construction: the materials and equipment required for construction are transported to the site, and the construction site is cleaned, S300: reconstruction for the front section, S400: reconstruction for the middle section, S500: reconstruction for the rear section. The inventiveness of the present disclosure is the application of segmentation construction, the front section is completely obsoleted, a transition section is provided at the middle, and the design of the rear section adopts a double-deck road, thus the original underground garage structure is fully utilized.

Abstract: An optoelectrical assembly includes a voltage conversion circuit, an optoelectrical semiconductor device, an optoelectrical detection circuit, and a controller. The voltage conversion circuit provides a bias voltage to the optoelectrical semiconductor device, and adjusts, by changing the bias voltage, an output optical power. A differential resistance value (Rdiff) of the optoelectrical semiconductor device within a range of a target optical power satisfies 0.1 ohm (?)?Rdiff?50?, and the differential resistance value is a ratio of a voltage variation to a current variation corresponding to the voltage variation. The optoelectrical detection circuit detects the output optical power, and outputs a detection signal to the controller. The controller determines a control signal based on the detection signal, and outputs the control signal to the voltage conversion circuit, where the control signal is used to adjust the bias voltage.

Abstract: An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core comprises a first surface and a second surface opposite the first surface, and a first sidewall between the first surface and the second surface. The glass core may include a conductor within a through-glass via extending from the first surface to the second surface and a build-up layer. The glass cord comprises a plurality of first areas of the glass core and a plurality of laser-treated areas on the first sidewall. A first one of the plurality of laser-treated areas may be spaced away from a second one of the plurality of laser-treated areas. A first area may comprise a first nanoporosity and a laser-treated area may comprise a second nanoporosity, wherein the second nanoporosity is greater than the first nanoporosity.

Abstract: A winding method may comprise clamping heads of an anode plate, a cathode plate and a separator between a first half winding needle and a second half winding needle of a winding needle assembly at a winding station; and rotating the winding needle assembly at the winding station to wind the anode plate, the cathode plate and the separator to form an electrode assembly.

Abstract: Interleukin-2 (IL-2) conjugates comprising at least one or more amino acid substitutions that bias binding to the IL-2 receptor ??c dimer over binding the IL-2 receptor ???c trimer and a non-natural amino acid at or near the N-terminus conjugated to a water-soluble polymer are described. The IL-2 conjugates are useful for treatment and prevention of cell proliferation and cancer in a patient.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.

Abstract: An inflatable folding tunnel reinforcement structure and a construction method thereof are provided. The inflatable folding tunnel reinforcement structure includes an inflation port, an airbag, a water blocking net, a steel plate, a scissor folding mechanism, a vertical support plate, an arc-shaped support plate, drainage channels, an upper support rod, a lower support rod, a locking pin, a threaded steel rod, a rolling connection pin, and an induction motor, where the upper support rod and the lower support rod are unfolded in opposite directions to a preset position through the steel rod; and the drainage channels are configured to perform water guidance and resistance for a leakage-proofing purpose. The construction method includes: preparation before construction, device fixation, on-site construction, structural inspection, and site cleaning. The present disclosure can treat various tunnel defects efficiently and conveniently and achieve a desired leakage-proofing effect.

Abstract: Embodiments of the present application provide a feeding device for loading a material into a container, which relates to the technical field of product assembly. The feeding device is configured to load a material into a container having an opening. The feeding device includes a pressing unit. The pressing unit includes a pressing member having a pressing plane, and a driving member configured to drive the pressing member to move cyclically along a closed track. The closed track includes a first planar track segment, and when the pressing member moves along the first planar track segment, the pressing plane forms surface contact with the material and keeps extending in a material loading direction, the material loading direction being a movement direction of the material relative to the container. The feeding device can reduce damage to the material during a feeding process.

Abstract: Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core, where the core comprises glass. In an embodiment, a first layer is under the core, a second layer is over the core, and a via is through the core, the first layer, and the second layer. In an embodiment a width of the via through the core is equal to a width of the via through the first layer and the second layer. In an embodiment, the package substrate further comprises a first pad under the via, and a second pad over the via.

Abstract: The compounds of the present invention are represented by the following compounds having Formula I and Formula (I?): where the substituents R1, R2, R2?, R3, R4, R5, R?, R?, X, Y, and Z are as defined herein and where the substituents R1, R2, R3, R4, R5, R?, R?, X, Y, and Z are as defined herein. These compounds are used in the treatment of bacterial infections, parasite infections, fungal infections, cancer, immunologic disorders, autoimmune disorders, neurodegenerative diseases and disorders, inflammatory disorders, or muscular dystrophy or for providing immunosuppression for transplanted organs or tissues.

Abstract: The compounds of the present invention are represented by the following compounds having Formula (I) where the substituents R1-R10, X, Y, k, m, n, q, and s are as defined herein. These compounds are used in the treatment of cancer, immunologic disorders, autoimmune disorders, neurodegenerative disorders, or inflammatory disorders or for providing immunosuppression for transplanted organs or tissues.