Abstract: The present application provides a new type of brushless high speed motor, in which the integrated shell and air duct are separately fixed to the outside of the inner hole column, the material of the air duct and the outer shell is BMC, and the material of the inner hole column is metal. The two parts are combined and configured to be made of different materials, which can effectively buffer and reduce the resonance point of the motor, and reduce the noise caused by the high speed rotation of the motor. In addition, the housing is configured as a split type, and the air duct and shell can be directly fixed outside the inner hole column by BMC injection molding, which reduces the processing technology, reduces the burr of the housing. A grounding post is provided on the outside of the stator package for grounding.

Abstract: An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core comprises a first surface and a second surface opposite the first surface, and a first sidewall between the first surface and the second surface. The glass core may include a conductor within a through-glass via extending from the first surface to the second surface and a build-up layer. The glass cord comprises a plurality of first areas of the glass core and a plurality of laser-treated areas on the first sidewall. A first one of the plurality of laser-treated areas may be spaced away from a second one of the plurality of laser-treated areas. A first area may comprise a first nanoporosity and a laser-treated area may comprise a second nanoporosity, wherein the second nanoporosity is greater than the first nanoporosity.

Abstract: Embodiments disclosed herein include glass cores and methods of forming glass cores. In an embodiment, a core for an electronic package comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass, In an embodiment, a via opening is provided through the substrate, and a diffusion layer is along the first surface, the second surface, and the via opening.

Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

Abstract: Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core, where the core comprises glass. In an embodiment, a first layer is under the core, a second layer is over the core, and a via is through the core, the first layer, and the second layer. In an embodiment a width of the via through the core is equal to a width of the via through the first layer and the second layer. In an embodiment, the package substrate further comprises a first pad under the via, and a second pad over the via.

Abstract: A face recognition monitoring system based on spectrum and multi-band fusion, including a spectrum camera, a first module for acquiring a face spectral image, a second module for preprocessing data of the face spectral image, a face spectral image database and a third module for recognizing the face spectral image. The spectrum camera includes an optical lens and a silicon-based detector. The silicon-based detector includes a photoelectric conversion substrate and a filter film arranged thereon. The filter film includes N units each including a visible spectrum sensing area, a near-infrared spectral image sensing area and a RGGB image acquisition area. The N units cover all pixels on the photoelectric conversion substrate. A recognition method using the above system is also provided.

Abstract: A face recognition monitoring system based on spectrum and multi-band fusion, including a spectrum camera, a first module for acquiring a face spectral image, a second module for preprocessing data of the face spectral image, a face spectral image database and a third module for recognizing the face spectral image. The spectrum camera includes an optical lens and a silicon-based detector. The silicon-based detector includes a photoelectric conversion substrate and a filter film arranged thereon. The filter film includes N units each including a visible spectrum sensing area, a near-infrared spectral image sensing area and a RGGB image acquisition area. The N units cover all pixels on the photoelectric conversion substrate. A recognition method using the above system is also provided.

Abstract: Disclosed are Lactobacillus rhamnosus strain 753 and uses thereof, a silage additive and silage. Lactobacillus rhamnosus strain 753 is deposited in China General Microbiological Culture Collection Center with an accession number of CGMCC 18233. Lactobacillus rhamnosus strain 753 can improve the quality of silage in a high-temperature and high-humidity region, and the silage processed by Lactobacillus rhamnosus strain 753 has good stability and low pH, low aflatoxin B1 content and less dry matter loss. In addition, secondary fermentation can be avoided in the silage processed by Lactobacillus rhamnosus strain 753 when a silo or bale for silage is opened.

Abstract: A cable assembly comprises a male connector plug, a circuit board and a cable. The circuit board has a first surface conductive layer and a second surface conductive layer that each include a plurality of front side pads and a plurality of rear side pads. The front side pads comprise four front side power pads soldered to four power terminals. The rear side pads comprise one rear side power pad and a soldering area of the rear side power pad is larger than a soldering area of the front side power pad. The circuit board is further at least provided with a first middle conductive layer positioned between the first surface conductive layer and the second surface conductive layer and a plurality of vias extending between layers.

Abstract: A cable assembly comprises a male connector plug, a circuit board and a cable. The circuit board has a first surface conductive layer and a second surface conductive layer that each include a plurality of front side pads and a plurality of rear side pads. The front side pads comprise four front side power pads soldered to four power terminals. The rear side pads comprise one rear side power pad and a soldering area of the rear side power pad is larger than a soldering area of the front side power pad. The circuit board is further at least provided with a first middle conductive layer positioned between the first surface conductive layer and the second surface conductive layer and a plurality of vias extending between layers.

Abstract: A communications device (100) and method (300) for selectively answering an incoming call received by the communications device (100). The method (100) provides an alert signal (330) in response to receiving; the incoming call (310) and then provides for automatically answering the incoming call (360) when the device detects (355) a change in state from an inoperative coupling state to an operative coupling state between the device (100) and an earpiece and microphone accessory (210).