Abstract: An active optical assembly includes a paddle card, an optical-electrical module including an opto-electronic communication device electrically connected with the paddle card, a heat sink ring mounted to the paddle card, an optical cable subassembly inserted into the heat sink ring and optically coupling with the optical-electrical module, and a heat sink cover mounted to the heat sink ring. The heat sink cover, the heat sink ring, and the paddle card cooperate to enclose the optical-electrical module so as to transfer heat generated by the opto-electronic communication device to the heat sink ring and the heat sink cover for dissipation.

Abstract: An optical-electrical connector (100) having an end for mating with an electrical connector and an opposite end coupling with an optical medium, includes a thermal conductive shell (10), a printed circuit board assembly (20) received in the thermal conductive shell, and an optical-electrical module (50). The printed circuit board assembly includes a printed circuit board (21) including a thermal conductive layer (214) thermal conductively connected with the metal shell. The optical-electrical module is mounted on the printed circuit board and is in contact with the thermal conductive layer, heat produced by the optical-electrical module being transmitted to the thermal conductive shell by the thermal conductive layer.

Abstract: An AOC assembly comprising two printed circuit boards (PCB) (63), a board holder (61) and two heat conducting covers (64) with integrated head spreader. Each of the two PC boards has a lower edge (632) extending in a longitudinal direction with circuit pads on opposite sides of PCB thereof. The board holder has two opposite vertical datum faces with two of said PC boards respectively positioned thereon. The two heat conducting covers oppositely fixed to the holder in a transverse direction perpendicular to the PC boards. When assembled, the integrated heat spreader of heat conducting shell would dissipate heat from the active electronic components on the PCB.

Abstract: A mezzanine connector assembly adapted to connecting a top PCB and a bottom PCB. The mezzanine connector assembly includes a floatable upper connector and a lower connector. The upper connector has an electrical connecting device and an optical connecting device. The electrical connecting device includes a conductor having a floatable upper end and a fixed lower end, the optical connecting device having an optical waveguide with one end connected to the upper PCB and a lower end fixed to the housing by a ferrule. The lower connector has a housing, a turning lens received in the housing, and an electrical contact connected to the bottom PCB for mating with the lower end of the conductor of the upper connector, the turning lens defining an upward opening to receive the ferrule of the upper connector, a forward opening for receiving an optical plug.

Abstract: An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.

Abstract: An electrical connector assembly (600) comprising a shielding housing (20) and a socket (40), and a buckle (60) assembled to the shielding housing. The shielding housing has a horizontal passage (22) and an entrance (220) backwardly communicating the passage and forwardly opening for receiving a plug (80). The socket is used for mating with a front end of a plug inserted therein. The buckle has a front latch (62) movable between an open position where a plug inside the shielding housing is permitted to be pulled out and a closed position where the front latch blocks the entrance of the shielding housing so that a plug inside the shielding housing is blocked from being pulled out.

Abstract: An optical-electrical connector (100) having an end for mating with an electrical connector and an opposite end coupling with an optical medium, includes a thermal conductive shell (10), a printed circuit board assembly (20) received in the thermal conductive shell, and an optical-electrical module (50). The printed circuit board assembly includes a printed circuit board (21) including a thermal conductive layer (214) thermal conductively connected with the metal shell. The optical-electrical module is mounted on the printed circuit board and is in contact with the thermal conductive layer, heat produced by the optical-electrical module being transmitted to the thermal conductive shell by the thermal conductive layer.

Abstract: An electrical connector assembly (600) comprising a shielding housing (20) and a socket (40), and a buckle (60) assembled to the shielding housing. The shielding housing has a horizontal passage (22) and an entrance (220) backwardly communicating the passage and forwardly opening for receiving a plug (80). The socket is used for mating with a front end of a plug inserted therein. The buckle has a front latch (62) movable between an open position where a plug inside the shielding housing is permitted to be pulled out and a closed position where the front latch blocks the entrance of the shielding housing so that a plug inside the shielding housing is blocked from being pulled out.

Abstract: A high speed card edge connector (20, 30) includes an insulative housing (21, 31), and a number of first, second, third, and fourth contacts (221-224) received in the insulative housing and arranged in a number of first columns (25) and a number of second columns (26). Each of the first columns includes one first, one second, and one third contacts. Each of the second columns includes one first, one fourth, and one third contacts. Each of the first to the fourth contacts includes a mounting portion (22b). The mounting portions of the second and the fourth contacts are designed as penetration type termination, and the mounting portions of the first and the third contacts are designed as surface mounted type termination. The mounting portions of the second and the fourth contacts are arranged in different rows.

Abstract: A high speed card edge connector (20, 30) includes an insulative housing (21, 31), and a number of first, second, third, and fourth contacts (221-224) received in the insulative housing and arranged in a number of first columns (25) and a number of second columns (26). Each of the first columns includes one first, one second, and one third contacts. Each of the second columns includes one first, one fourth, and one third contacts. Each of the first to the fourth contacts includes a mounting portion (22b). The mounting portions of the second and the fourth contacts are designed as penetration type termination, and the mounting portions of the first and the third contacts are designed as surface mounted type termination. The mounting portions of the second and the fourth contacts are arranged in different rows.

Abstract: An AOC assembly comprising two printed circuit boards (PCB) (63), a board holder (61) and two dust proof, heat conducting metal covers (64) with integrated head spreader. Each of the two PC boards has a lower edge (632) extending in a longitudinal direction with circuit pads on opposite sides of PCB thereof. The board holder has two opposite vertical datum faces with two of said PC boards respectively positioned thereon. The two heat conducting covers oppositely fixed to the holder in a transverse direction perpendicular to the PC boards. When assembled, the integrated heat spreader of heat conducting metal shell would touch the active electronic components on the PCB and dissipate their excessive heat therefrom.

Abstract: An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.

Abstract: Locally heated low temperature solder glass is used to permanently fix an optical fiber with sub-micron precision to a glass ceramic submount inside a high power pump laser module. The fiber is manipulated into a predetermined alignment while the solder glass is still molten and the solder glass is then cooled to its solidified state. The predetermined alignment may include an offset to compensate for subsequent thermally related dimensional changes as the solder glass cools and solidifies. If necessary, the solder glass can be remelted and the fiber realigned with a different offset if the first alignment attempt is less than optimal. This alignment process has been demonstrated to provide reliable and efficient coupling of an optical fiber to a high power pump laser within very tight tolerances. A similar process can also be applied to other micro-optics assemblies where high precision, high reliability fiber fixing is required.

Abstract: Locally heated low temperature solder glass is used to permanently fix an optical fiber with sub-micron precision to a glass ceramic submount inside a high power pump laser module. The fiber is manipulated into a predetermined alignment while the solder glass is still molten and the solder glass is then cooled to its solidified state. The predetermined alignment may include an offset to compensate for subsequent thermally related dimensional changes as the solder glass cools and solidifies. If necessary, the solder glass can be remelted and the fiber realigned with a different offset if the first alignment attempt is less than optimal. This alignment process has been demonstrated to provide reliable and efficient coupling of an optical fiber to a high power pump laser within very tight tolerances. A similar process can also be applied to other micro-optics assemblies where high precision, high reliability fiber fixing is required.

Abstract: A tunable, reconfigurable optical add/drop multiplexer comprises a first signal routing component and at least one wavelength selective switch having an input port and an output port. The input port is optically coupled to the first signal routing component. The wavelength signal selective switch is wavelength tunable, so as to allow a selected wavelength to be routed to the first signal routing component and the rest of the wavelengths to be routed to the output port. According to an embodiment of the present invention the first signal routing component is an optical circulator.

Abstract: Optical components, particularly microoptic glass components used in synthesizing birefringence in filter systems based on polarization interferometer techniques, are fabricated using systems and methods which provide accurate frequency periodicity measurements. These measurements are derived from differential delays induced by in-process glass elements between beam components in a polarization interferometer unit and from progressive wavelength scanning across a wavelength band of interest. The consequent sinusoidal output variation has peak to peak spacings which are measured to provide frequency periodicity values from which precise length corrections for the optical elements can be calculated.

Abstract: Optical components, particularly microoptic glass components used in synthesizing birefringence in filter systems based on polarization interferometer techniques, are fabricated using systems and methods which provide accurate frequency periodicity measurements. These measurements are derived from differential delays induced by in-process glass elements between beam components in a polarization interferometer unit and from progressive wavelength scanning across a wavelength band of interest. The consequent sinusoidal output variation has peak to peak spacings which are measured to provide frequency periodicity values from which precise length corrections for the optical elements can be calculated.

Abstract: Interleavers for optical systems, including multiplexers and demultiplexers, are based on the use of non-birefringent elements in combination with polarization beam splitter to provide differential retardation effects for generation of precise transmittance functions. The retardation elements, in one particular example, are non-birefringent glasses arranged in individually athermal stages but the optical beams propagated through them are maintained in selected polarization states in each stage. Between or within the stages the polarization vectors are varied to match phase to a selected standard, such as an ITU grid. Within the stages, selected beam angle adjustments are made to shape the output transmittance characteristic.