Abstract: An assembly device for assembling a screw into a locking hole of a circuit board includes an assembled board and a guiding sleeve. The assembled board is configured to press against a circuit board. The guiding sleeve is movably arranged in the assembled board. A vertical channel is formed in an interior of the guiding sleeve. When the assembled board presses against the circuit board, one end of the guiding sleeve abuts against the circuit board, and the vertical channel is opposite to the screw hole on the circuit board. The screw is accurately assembled into the screw hole of the circuit board, thereby improving assembly efficiency.

Abstract: An assembly device for assembling a screw into a locking hole of a circuit board includes an assembled board and a guiding sleeve. The assembled board is configured to press against a circuit board. The guiding sleeve is movably arranged in the assembled board. A vertical channel is formed in an interior of the guiding sleeve. When the assembled board presses against the circuit board, one end of the guiding sleeve abuts against the circuit board, and the vertical channel is opposite to the screw hole on the circuit board. The screw is accurately assembled into the screw hole of the circuit board, thereby improving assembly efficiency.

Abstract: A method for inlaying a gold ornament is disclosed. A substrate is provided which has an outer surface. A groove is defined in the substrate through the outer surface. A gold ornament is manufactured. The gold ornament has substantially the same shape as the groove. The gold ornament is placed in the groove wherein is positioned with metallic solder. Then the substrate is heated, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate. A housing for electronic device inlaid with a gold ornament made by the present method is also provided.