Abstract: The present disclosure further relates to a linker-payload compound including an oligosaccharide group, especially a disaccharide group, where the oligosaccharide group is linked to the remainder of the compound by an amide bond. The present disclosure further relates to an antibody-drug conjugate (ADC) containing the linker-payload compound, where the glycan chain in an antibody is remodeled with the oligosaccharide moiety in the linker-payload compound. The present disclosure further relates to preparation methods and use of the above-mentioned substances.

Abstract: The present disclosure relates to a linker molecule for targeting molecule-drug conjugate, and the corresponding conjugate, the preparation and use thereof.

Abstract: A conjugate and preparation method therefor, comprising a medication composition comprising the conjugate and a use of the medication composition in preparing medications for the treatment or prevention of diseases.

Abstract: A method of preparation of titanium and titanium alloy powder for 3D printing is based on a fluidized bed jet milling technique. Hydride-dehydrite titanium powder and titanium alloy powder are used as main raw material powder, jet milling and shaping are carried out in shielding atmosphere of nitrogen or argon, and finally high-performance titanium and titanium alloy powder meeting the requirements of 3D printing process is obtained. The titanium and titanium alloy powder prepared using this method has a narrow particle size distribution, approximately spherical shape, and controllable oxygen content.

Abstract: The present invention provides a conjugate and preparation method thereof, a pharmaceutical composition comprising the conjugate and use of the pharmaceutical composition in the manufacture of a medicament for the treatment or prevention of a disease.

Abstract: A wiring design method and a wiring structure for a package substrate in a flip chip, and a flip chip. The wiring design method includes: arranging bump pads in an array of rows and columns, wherein the bump pads are configured to bond with conductive bumps on a flip chip die, and the bump pads comprise signal pads and non-signal pads; providing the non-signal pad with a via hole; and using a layer of wiring to lead a subset of the signal pads out of an orthographic projection region of the flip chip die on the package substrate, wherein the subset of the signal pads is configured to carry all functional signals required by design specifications of the flip chip die for the array of the bump pads.

Abstract: The present disclosure relates to the biopharmaceutical field, in particular, Exatecan derivatives, linker-payloads, and conjugates and thereof antibody-drug conjugates, and the corresponding preparing process and use thereof.

Abstract: The present disclosure relates to the field of biotechnology. In particular, provided are a ligase fusion protein and an immobilized ligase comprising the same. Also provided is use of the ligase fusion protein or the immobilized ligase in the preparation of conjugates. Further provided is a process for the preparation of conjugates using a ligase or a ligase unit.

Abstract: The present disclosure relates to a linker molecule for targeting molecule-drug conjugate, and the corresponding conjugate, the preparation and use thereof.

Abstract: The present disclosure relates to a linking unit molecule for targeting molecule-drug conjugate, and the corresponding conjugate, the preparation and use thereof, and in particular relates to an antibody-immune agonist conjugate (AIAC) as a novel type of cancer therapy.

Abstract: The present disclosure relates to the biopharmaceutical field, in particular, Exatecan derivatives, linker-payloads, and conjugates and thereof antibody-drug conjugates, and the corresponding preparing process and use thereof.

Abstract: It relates to the medicinal chemistry field, particularly to a process for separating the isomeric compounds comprising a ring-opened thiosuccinimide group and a chiral moiety.

Abstract: The present disclosure relates to the biopharmaceutical field, in particular, Exatecan derivatives, linker-payloads, and conjugates and thereof antibody-drug conjugates, and the corresponding preparing process and use thereof.

Abstract: A linker molecule for targeting molecule-drug conjugate, has the structure of formula (I): A1p-D1q-Y-Lk-W-A2q-D2p (I). A conjugate has the structure of formula (III): A-((compound of formula (1))-PL t) z (III). The conjugate can be used in the manufacture of a medicament for treating a disease.

Abstract: The present disclosure relates to a linking unit molecule for targeting molecule-drug conjugate, and the corresponding conjugate, the preparation and use thereof, and in particular relates to an antibody-immune agonist conjugate (AIAC) as a novel type of cancer therapy.

Abstract: A conjugation device includes at least one flow reactor having an inlet and an outlet, the flow reactor(s) being completely filled with a support such as a matrix including 1) chromatography beads, fibers or membranes, and 2) a biologic catalyzer, namely the enzyme ligase, which is immobilized onto this support; a fluid delivery unit in fluid communication with the inlet of the flow reactor(s) and configured to continuously provide the flow reactor(s) with at least one kind of reaction fluid such as antibody and linker-payload according to stages of the conjugation process, the at least one kind of process fluid including a first moiety and a second moiety of a conjugate to be produced; and a fluid collection unit in fluid communication with the outlet of the flow reactor(s) and configured to control collection of fluid flowing out of the outlet of the flow reactor(s) according to the stages of the conjugation process.

Abstract: A wiring design method and a wiring structure for a package substrate in a flip chip, and a flip chip. The wiring design method includes: arranging bump pads in an array of rows and columns, wherein the bump pads are configured to bond with conductive bumps on a flip chip die, and the bump pads comprise signal pads and non-signal pads; providing the non-signal pad with a via hole; and using a layer of wiring to lead a subset of the signal pads out of an orthographic projection region of the flip chip die on the package substrate, wherein the subset of the signal pads is configured to carry all functional signals required by design specifications of the flip chip die for the array of the bump pads.

Abstract: The present disclosure relates to the field of biotechnology. In particular, provided are a ligase fusion protein and an immobilized ligase comprising the same. Also provided is use of the ligase fusion protein or the immobilized ligase in the preparation of conjugates. Further provided is a process for the preparation of conjugates using a ligase or a ligase unit.

Abstract: Provided are novel anti-TROP2 antibodies, novel antibody-drug conjugates, and methods for preparing the same, as well as applications of the antibodies and antibody-drug conjugates for therapeutic purpose.

Abstract: A conjugation device includes at least one flow reactor having an inlet and an outlet, the flow reactor(s) being completely filled with a support such as a matrix including 1) chromatography beads, fibers or membranes, and 2) a biologic catalyzer, namely the enzyme ligase, which is immobilized onto this support; a fluid delivery unit in fluid communication with the inlet of the flow reactor(s) and configured to continuously provide the flow reactor(s) with at least one kind of reaction fluid such as antibody and linker-payload according to stages of the conjugation process, the at least one kind of process fluid including a first moiety and a second moiety of a conjugate to be produced; and a fluid collection unit in fluid communication with the outlet of the flow reactor(s) and configured to control collection of fluid flowing out of the outlet of the flow reactor(s) according to the stages of the conjugation process.