Abstract: A curved-gate transistor structure, wherein gate regions of the curved-gate transistor structure are curved, wherein the curved-gate transistor structure comprises semiconductor structural units, each semiconductor structural unit further comprises body contact regions, the body contact regions and source region are on the same side of the gate region, each semiconductor structural unit further comprises a curved gate region; the body contact regions are added near the source region, and contact regions of each of the semiconductor structural units structure can easily form a network to enhance latch-up resistance; each of the first metal blocks can be connected to a same or different potential, and the two branches of the gate regions of the same semiconductor structural unit can also be connected to a same or different potential.

Abstract: A display apparatus and a pixel circuit. The pixel circuit includes: a first storage sub-circuit, connected between a first node and a second node; a data writing sub-circuit, configured to charge the second node; a driving sub-circuit, configured to control connection or disconnection between a third node and a fourth node under control of the first node; a compensation sub-circuit, configured to control connection or disconnection between the first node and the fourth node under control of a first scan signal end; a luminous control sub-circuit, configured to control connection or disconnection between a first power end and the third node under control of a first luminous control signal end, and further configured to control connection or disconnection between the fourth node and a first electrode of a sub-pixel under control of a second luminous control signal. The present disclosure can improve display effect.

Abstract: A preforming method for a high-strength steel variable-diameter tubular part is provided, which belongs to the technical field of metal forming process. The preforming method for a high-strength steel variable-diameter tubular part includes: selecting a tubular blank; and preparing a tubular blank forming mold, where the tubular blank forming mold includes a preforming mold and a final forming mold; sealing and pressurizing the tubular blank; heating the tubular blank by using electrodes; preforming the tubular part at a constant temperature; maintaining a temperature Tl and moving the preformed tubular part to the final forming mold; finally forming the tubular part. Through two steps of operation of preforming and final forming, and maintaining a temperature during moving the tubular blank between the two steps, so that the conversion of intrametallic structure between the two steps is improved, and the performance of the tubular part is improved.

Abstract: A CT energy extraction device is provided. A first accommodation cavity is provided in a first housing, and a second accommodation cavity is provided in a second housing. The first housing can be connected and joined with the second housing to form a ring shape, which is used to be placed on outside of a high-voltage line. A first iron core is disposed in the first accommodation cavity, and an energy-extraction coil is wound around the first iron core. A cable outlet is provided on the first housing, and the energy-extraction coil has pins extending from the cable outlet. A second iron core is disposed in the second accommodation cavity. When the first housing and the second housing are connected and joined, the first and second iron cores are joined to form a closed ring structure. An inflating assembly is provided on the first housing and/or the second housing.

Abstract: In one aspect, an apparatus includes: a first feedback digital-to-analog converter (DAC) to receive a first feedback signal from a first successive approximation register (SAR) and output a first analog signal; a comparator to compare the first analog signal with a reference voltage; the first SAR to store a digital value based on the comparison and provide the first feedback signal to the first DAC; a second feedback DAC to receive a modulated quantized residual error based on the comparison and output a second analog signal; a second SAR to store a quantized residual error; and a delta-sigma modulator (DSM) to modulate the quantized residual error and provide the modulated quantized residual error to the second feedback DAC.

Abstract: Positive and negative glitch detectors detect glitches on a supply voltage node. The positive glitch detector has a capacitor and a resistor serially coupled between the supply voltage node and ground. An amplifier is coupled to a first node between the capacitor and resistor. A positive glitch results in the glitch on the first node (normally biased low) and generation of a clock pulse by the amplifier that causes a latch to assert its output to indicate the positive glitch. The negative glitch detector has a capacitor and resistor coupled in parallel between the supply voltage node and a second node. A negative glitch on the supply voltage node decreases the voltage on the second node (normally biased high) and an inverting amplifier coupled to the second node generates a clock pulse to cause a latch to assert its output to indicate the negative voltage glitch.

Abstract: Forming a protective coating ex situ in an atomic layer deposition process to coat one or more chamber components subsequently installed in a reaction chamber provides a number of benefits over more conventional coating methods such as in situ deposition of an undercoat. In certain cases the protective coating may have a particular composition such as aluminum oxide, aluminum fluoride, aluminum nitride, yttrium oxide, and/or yttrium fluoride. The protective coating may help reduce contamination on wafers processed using the coated chamber component. Further, the protective coating may act to stabilize the processing conditions within the reaction chamber, thereby achieving very stable/uniform processing results over the course of processing many batches of wafers, and minimizing radical loss. Also described are a number of techniques that may be used to restore the protective coating after the coated chamber component is used to process semiconductor wafers.

Abstract: A circuit board with embedded resistors and a method for fabricating the same are provided. The circuit board includes the circuit substrate and the variable resistor region. The variable resistor region includes the first resistor layer, the second resistor layer and the liquid metal material. The first resistor layer is electrically connected to the circuit substrate, and the second resistor layer overlaps the first resistor layer. The liquid metal material is located on and is electrically connected to the first resistor layer. The liquid metal material is spaced from the second resistor layer without any electrical connection under the initial temperature. The liquid metal material is electrically connected to the second resistor layer under the first temperature which is higher than the initial temperature.

Abstract: Embodiments of the present disclosure relate to methods and devices for channel state information (CSI) transmission. In example embodiments, a method implemented in a terminal device includes performing a channel estimate between the terminal device and a network device across a predetermined frequency range for a set of beams having different spatial directions; determining, based on the channel estimate, first indication information indicating at least one beam selected from the set of beams and second indication information indicating frequency-related information for the at least one selected beam at a plurality of frequency locations in the predetermined frequency range; and transmitting to the network device the first indication information in a first part of a channel state information (CSI) report and the second indication information in a second part of the CSI report.

Abstract: Embodiments of the present disclosure provide methods, devices and computer readable media for multi-TRP communication. In a method for communication, a terminal device receives control information from at least one of a first network device and a second network device. The terminal device determines, from the control information, a first parameter for communication of a first data between the first network device and the terminal device and a second parameter for communication of a second data between the second network device and the terminal device, and the first data and the second data are identical. The terminal device performs, based on the first and second parameters, the communication of the first data with the first network device and the communication of the second data with the second network device. The embodiments of the present disclosure propose a new design of control information for multi-TRP communication.

Abstract: A capacitor can include a bottom conductive structure; at least one middle conductive structure, each middle conductive structure having a first conductive pattern and a second conductive pattern surrounding an outer side of the first conductive pattern, where the first conductive pattern and the second conductive pattern of each layer of the middle conductive structure form an interdigitated structure; and a top conductive structure having a third conductive pattern and a fourth conductive pattern arranged at an outer side of the third conductive pattern, where the third conductive pattern and the fourth conductive pattern form an interdigitated structure.

Abstract: A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a first dielectric layer, a second dielectric layer disposed on the first dielectric layer, a signal layer disposed within the second dielectric layer, a third dielectric layer disposed on the second dielectric layer, and liquid metal composites. The signal layer includes a trace and a pad. The liquid metal composites are disposed to surround the trace, but not enclose the pad, thereby satisfying requirements of the signal layer for great bending numbers and high frequency signal transmission.

Abstract: An ATR kinase inhibitor as shown in formula I, and a preparation method therefor and the use thereof.

Abstract: In one embodiment, an apparatus includes: a replica sampler circuit to sample a first voltage that is based on a reference voltage, the replica sampler circuit to at least approximate a non-linearity of a bias generator. The replica sampler circuit may include: a switch circuit, when enabled, to pass the first voltage; and a capacitor coupled to the switch circuit, the capacitor to be charged by the first voltage. The apparatus also may include a comparator coupled to the replica sampler circuit, the comparator having a first input terminal to receive the sampled first voltage and a second input terminal to receive the reference voltage, where the comparator is to output a first signal having a first value when the sampled first voltage departs from the reference voltage by at least a threshold amount, to cause a refresh of at least a portion of the bias generator.

Abstract: A multi-layer headgear system may comprise one or more of a head-mounted display adapter plate, a headgear frame, a sensor-engagement assembly, and/or other components. A first side of the head-mounted display adapter plate may be configured to be attached to a head-mounted display. A second side of the head-mounted display adapter plate may be configured to be attached to a first side of the headgear frame. A first side of the sensor-engagement assembly may be configured to be attached to a second side of the headgear frame. The sensor-engagement assembly may be configured to position one or more sensors with respect to a face.

Abstract: A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.

Abstract: A circuit board includes an inner wiring substrate and a first side plate. The inner wiring substrate includes a plurality of first connection pads at a side. The first side plate is disposed on the inner wiring substrate and defines a plurality of first holes exposing the first connection pads. Each first hole includes a first end facing the first connection pad and a second end facing away from the first connection pad. A central distance between two adjacent first connection pads is greater than a center distance between two second ends of two adjacent first holes. The first holes are filled with first conductive bodies, each first conductive body is electrically connected to the first connection pad and extends out of the first hole to form a connection portion. A method for manufacturing the circuit board and a display module are also disclosed.

Abstract: A multi-layer headgear system may comprise one or more of a head-mounted display adapter plate, a headgear frame, a sensor-engagement assembly, and/or other components. A first side of the head-mounted display adapter plate may be configured to be attached to a head-mounted display. A second side of the head-mounted display adapter plate may be configured to be attached to a first side of the headgear frame. A first side of the sensor-engagement assembly may be configured to be attached to a second side of the headgear frame. The sensor-engagement assembly may be configured to position one or more sensors with respect to a face.

Abstract: This application provides a method for training a semantic understanding model, including: obtaining a first training sample set; performing denoising processing on the first training sample set to form a corresponding second training sample set; processing the second training sample set by using a semantic understanding model, to determine initial parameters of the semantic understanding model; processing the second training sample set by using the semantic understanding model in response to the initial parameters of the semantic understanding model, to determine update parameters of the semantic understanding model; and iteratively updating a semantic representation layer network parameter and a task-related output layer network parameter of the semantic understanding model by using the second training sample set and according to the update parameters of the semantic understanding model.

Abstract: An ear apparatus may comprise one or more of a housing, an electrode, a biometric sensor, a speaker driver, and/or other components. The housing of the ear apparatus may be configured to be attached to an ear. The electrode may be carried by the housing. The electrode may be configured to measure an electrical signal from the ear. The electrical signal may include a reference signal, a ground signal, or a bias signal. The biometric sensor may be carried by the housing. The biometric sensor may be configured to measure one or more biometric characteristics from the ear. The speaker driver may be carried by the housing. The speaker driver may be configured to produce sound.