Abstract: A magnetic structure can include: a first magnetic component and a second magnetic component; two magnetic columns configured to form a magnetic flux loop with at least part of the first magnetic component and at least part of the second magnetic component, where at least one of the two magnetic columns is wound with one or more windings; and where the at least part of the first magnetic component is located between the two magnetic columns.

Abstract: An integrated substrate can include: a top structure having a plurality of first pads for mounting electronic devices, where each of the first pads is electrically coupled with a corresponding electronic device, such that each of the first pads has a corresponding potential; a bottom structure having a plurality of second pads for coupling with peripheral circuits; a plurality of intermediate metal layers stacked up/down and located between the top structure and the bottom structure; a first type of penetrating connection structures configured to couple the intermediate metal layers and a part of the first pads, such that the intermediate metal layers have the same potential as the part of the first pads; and a second type of penetrating connection structures configured to couple the intermediate metal layers and the second pads, such that the second pads have the same potential as the part of the first pads.

Abstract: A lumped power supply circuit for converting an AC signal into a DC signal, the lumped power supply circuit including: a cascaded H-bridge circuit having N H-bridge sub-circuits connected in series between two input terminals of the AC signal, and being configured to convert the AC signal into N first voltage signals, where N is a positive integer greater than or equal to 2; a high-frequency filtering module configured to filter the N first voltage signals, and to generate N second voltage signals; a DC conversion module to receive the N second voltage signals, and to convert the N second voltage signals into at least one third voltage signal; and a lumped power buffer module having an output terminal coupled to a load, and being configured to receive the at least one third voltage signal, and to filter out part of power frequency fluctuations in the third voltage signal.

Abstract: A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.