Patents by Inventor Gao-Long Wu

Gao-Long Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
    Publication number: 20240055371
    Abstract: Embodiments include a crack stopper structure surrounding an embedded integrated circuit die, and the formation thereof. The crack stopper structure may include multiple layers separated by a fill layer. The layers of the crack stopper may include multiple sublayers, some of the sublayers providing adhesion, hardness buffering, and material gradients for transitioning from one layer of the crack stopper structure to another layer of the crack stopper structure.
    Type: Application
    Filed: January 9, 2023
    Publication date: February 15, 2024
    Inventors: Der-Chyang Yeh, Kuo-Chiang Ting, Yu-Hsiung Wang, Chao-Wen Shih, Sung-Feng Yeh, Ta Hao Sung, Cheng-Wei Huang, Yen-Ping Wang, Chang-Wen Huang, Sheng-Ta Lin, Li-Cheng Hu, Gao-Long Wu