Abstract: A microelectronic device is formed by loading a wafer, in which the microelectronic device is being formed, onto a pre-alignment stage for a wafer stepper. If the pre-alignment stage does not align the wafer properly using a notch pin, the wafer is loaded onto a wafer stepper stage of the wafer stepper. The wafer is positioned under a Field Image Alignment (FIA) camera of the wafer stepper, so that the FIA camera provides an image of the wafer notch. The wafer is rotated into a proper position. The wafer is transferred back to the pre-alignment stage. The wafer is aligned using the notch pin. The wafer is transferred to the wafer stepper stage. Fabrication is continued to form the microelectronic device.