Abstract: An optical transceiver module includes an optical fiber and an optical fiber positioning structure that fixes the optical fiber. The optical fiber positioning structure includes a first positioning part that fixes the said optical fiber, and a first supporting part that fixes the first positioning part on a case of the optical transceiver module. The first positioning part includes a first end face and a second end face opposite to one another, and a first through-hole that connects the first and second end faces. The inner diameter of the first through-hole is substantially equal to the diameter of the optical fiber, and the optical fiber is fixed within the first through-hole. The first supporting part includes an accommodating portion for accommodating the first positioning part. The first positioning part is fixed in the accommodating portion.

Abstract: An optical transceiver module includes an optical fiber and an optical fiber positioning structure that fixes the optical fiber. The optical fiber positioning structure includes a first positioning part that fixes the said optical fiber, and a first supporting part that fixes the first positioning part on a case of the optical transceiver module. The first positioning part includes a first end face and a second end face opposite to one another, and a first through-hole that connects the first and second end faces. The inner diameter of the first through-hole is substantially equal to the diameter of the optical fiber, and the optical fiber is fixed within the first through-hole. The first supporting part includes an accommodating portion for accommodating the first positioning part. The first positioning part is fixed in the accommodating portion.

Abstract: A wavelength division multiplexing/de-multiplexing optical assembly for high speed parallel long distance transmission, wherein, the output terminal of the laser group is provided with the silicon lens group, the optical adjusting plate group, the lower layer silicon lens array, the lower layer filter group, and the lower layer free space wavelength division multiplexer, the optical isolator, and the focusing lens arranged in turn; the output terminal of the focusing lens is coupled with an input optical fiber; an output optical fiber is coupled with the collimating lens; the output terminal of the collimating lens is coupled with a prism; the output terminal of the prism is provided with the upper layer free space wavelength division multiplexer, the upper layer filter group, the upper layer silicon lens array and the detector group arranged in turn. Thereby, multiplexing/de-multiplexing of optical signals is realized by use of filter groups.

Abstract: A surface mount packaging structure for semiconductor optical device and packaging method. A semiconductor optical device, disposed on a substrate, is electrically connected with a substrate through wires. A lower surface of the substrate is fixed on an upper surface of a flexible printed board that is provided with internal leads and external leads. The internal leads are electrically connected with the substrate through wires. A lower surface of the flexible printed board is fixed on a base board. A glass baffle is provided to form a window in front of a light-emitting or light-receiving surface of the semiconductor optical device. A focusing lens is adhered to the window of the glass baffle and is coupled with an optical path of the semiconductor optical device. The substrate and the semiconductor optical device thereon, the wires, and the internal leads on the flexible printed board are encased into packaging material.