Abstract: The present invention relates to a vacuum pumping and abatement system for evacuating processing gas from a process chamber and removing noxious substances from the processing gas. The present invention also relates to a method of purging a vacuum pumping arrangement. The present invention seeks to reduce the cost of ownership and operation and carbon footprint of such systems, by providing a vacuum pumping and abatement system for evacuating processing gas from a process chamber and removing noxious substances from the processing gas, comprising a vacuum pumping arrangement for evacuating processing gas from a process chamber; a source of compressed air for purging the vacuum pumping arrangement during evacuation; and a burner for receiving processing gas and compressed air from the vacuum pumping arrangement and removing noxious substances therefrom by burning the processing gas in oxygen wherein at least some of the oxygen that supports combustion is derived from the compressed air.

Abstract: The present invention relates to a vacuum pumping and abatement system for evacuating processing gas from a process chamber and removing noxious substances from the processing gas. The present invention also relates to a method of purging a vacuum pumping arrangement. The present invention seeks to reduce the cost of ownership and operation and carbon footprint of such systems, by providing a vacuum pumping and abatement system for evacuating processing gas from a process chamber and removing noxious substances from the processing gas, comprising a vacuum pumping arrangement for evacuating processing gas from a process chamber; a source of compressed air for purging the vacuum pumping arrangement during evacuation; and a burner for receiving processing gas and compressed air from the vacuum pumping arrangement and removing noxious substances therefrom by burning the processing gas in oxygen wherein at least some of the oxygen that supports combustion is derived from the compressed air.

Abstract: Apparatus is described for treating an effluent fluid stream from a semiconductor manufacturing process tool. The apparatus comprises a combustion chamber, means for heating the combustion chamber, and a nozzle for injecting the effluent stream into the combustion chamber. The apparatus is configured to enable a fuel and an oxidant to be selectively injected into the effluent stream as required to optimise the combustion conditions for a particular effluent stream. In one to embodiment, a lance projecting into the nozzle selectively injects an oxidant into the effluent stream, and a sleeve surrounding the nozzle selectively injects a fuel into the effluent stream.

Abstract: Chemical vapour deposition apparatus comprises a process chamber, a bubbler for supplying a volatile precursor to the chamber, a vacuum pump for drawing an exhaust gas from the process chamber, an abatement device for treating the exhaust gas, and a bypass line for conveying the precursor from the bubbler to the abatement device, the bypass line bypassing both the process chamber and the vacuum pump.