Abstract: In a method and system for laser induced forward transfer (LIFT), energy (E1,E2) is deposited according to a non-Gaussian intensity profile (Ixy) which is spatially tuned across an interface (11xy) of the donor material (11m) to cause the donor material (11m) to be ejected from the donor substrate as an extended jet (Je) momentarily bridging the transfer distance (Zt) between the donor substrate (11) and the acceptor substrate (12) during a transfer period (Tt). A locally increased intensity spike (Is) at a center of the intensity profile (Ixy) causes a relatively thick jet (J1) of donor material to branch into a relatively thin jet (J2) at a branching position (J12) between the donor substrate (11) and acceptor substrate (12). The thick jet (J1) allows a relatively large transfer (Zt) distance while the thin jet (J2) deposits a relatively small droplet (Jd) of donor material (11m).

Abstract: The present disclosure concerns methods for the manufacturing of products with printed conductive tracks. The process comprising scribing a first trench into the surface of the object, wherein on a border of the trench a first ridge is formed to define a first edge of a material receiving track. At a distance from the first trench a second trench is formed, wherein on the borders of the second trench a second ridge is formed facing the first ridge. The first and second ridges define a material receiving track which may be provided with a material suited to form a conductive track.

Abstract: The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

Abstract: A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

Abstract: A method and apparatus for transferring components. A first substrate is provided with the components. A second substrate is provided with an adhesive layer comprising a hot melt adhesive material. The components on the first substrate are contacted with the adhesive layer on the second substrate while the adhesive layer is melted. The adhesive layer is allowed to solidify to form an adhesive connection between the components and the second substrate. The first and second substrates are moved apart to transfer the components. At least a subset of the components is transferred from the second substrate to a third substrate by radiating light onto the adhesive layer to form a jet of melted material carrying the components.

Abstract: A method and apparatus for light induced selective transfer of components. A donor substrate (10) with a plurality of components (11,12) divided in different subsets arranged according to respective layouts (A,B). A target substrate (20) comprises recesses (21) and protrusions (25). The donor and target substrates (10,20) are aligned such that a first subset of components (11) is suspended over corresponding recesses (21) in the target substrate (20) and a second subset of components (12) is in contact with corresponding protrusions (25) of the target substrate (20). Light (L) is projected onto the donor substrate (10) to transfer the first subset of components (11) across and into the corresponding recesses (21) while the second subset of components (12) remains attached to the donor substrate (10).

Abstract: In a method and system for laser induced forward transfer (LIFT), energy (E1,E2) is deposited according to a non-Gaussian intensity profile (Ixy) which is spatially tuned across an interface (11xy) of the donor material (11m) to cause the donor material (11m) to be ejected from the donor substrate as an extended jet (Je) momentarily bridging the transfer distance (Zt) between the donor substrate (11) and the acceptor substrate (12) during a transfer period (Tt). A locally increased intensity spike (Is) at a center of the intensity profile (Ixy) causes a relatively thick jet (J1) of donor material to branch into a relatively thin jet (J2) at a branching position (J12) between the donor substrate (11) and acceptor substrate (12). The thick jet (J1) allows a relatively large transfer (Zt) distance while the thin jet (J2) deposits a relatively small droplet (Jd) of donor material (11m).

Abstract: A method for applying a patterned structure on a surface, comprising providing a donor substrate (1) comprising donor material (1a) between a light source (3) and a receiving surface (5), providing by means of the light source (3) a light pulse (3a) directed to the donor substrate (1), the light pulse (3a) being configured to cause the donor material (1a) to be transferred from the donor substrate (1) onto the receiving surface (5), wherein the donor substrate (1) comprises a pattern (2) of donor material (1a) on discrete portions (2a) of the donor substrate (1). The pattern (2) on the donor substrate (1) is transferred so as to form a pattern (4) of donor material (1a) on the receiving surface (5).

Abstract: The present disclosure concerns methods for the manufacturing of products with printed conductive tracks. The process comprising scribing a first trench into the surface of the object, wherein on a border of the trench a first ridge is formed to define a first edge of a material receiving track. At a distance from the first trench a second trench is formed, wherein on the borders of the second trench a second ridge is formed facing the first ridge. The first and second ridges define a material receiving track which may be provided with a material suited to form a conductive track.

Abstract: A deposition method is provided wherein a donor substrate (10) is arranged opposite a target substrate (20), the donor substrate having a surface (12) facing the target substrate that is provided with a viscous donor material (14). An optical beam (30) is directed via the donor substrate to the donor material so as to release the donor material and to therewith transfer the donor material as a jet towards the target substrate. In the method provided herein an input signal (DS) is received that specifies a shape to be assumed by the jet with which the donor material is to be transferred and an energy profile of the optical beam is accordingly controlled. Additionally or alternatively the energy profile of the optical beam may be controlled in accordance with a pattern according to which the donor material is to be deposited on the target substrate. Likewise a corresponding deposition apparatus is provided.

Abstract: The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

Abstract: A method and apparatus for light induced selective transfer of components. A donor substrate (10) with a plurality of components (11,12) divided in different subsets arranged according to respective layouts (A,B). A target substrate (20) comprises recesses (21) and protrusions (25). The donor and target substrates (10,20) are aligned such that a first subset of components (11) is suspended over corresponding recesses (21) in the target substrate (20) and a second subset of components (12) is in contact with corresponding protrusions (25) of the target substrate (20). Light (L) is projected onto the donor substrate (10) to transfer the first subset of components (11) across and into the corresponding recesses (21) while the second subset of components (12) remains attached to the donor substrate (10).

Abstract: The present invention relates to a composition comprising a) one or more resin; b) electrically conductive particles and/or non-conductive particles and/or thermally conductive particles; and c) from 5 to 40% of a solvent and/or a reactive diluent by weight of the total weight of the composition, wherein said solvent and/or reactive diluent has a boiling point higher than 130° C., and wherein said composition has no crossing over of the storage modulus (G?) and the loss modulus (G?), and wherein the storage modulus (G?) is lower than the loss modulus (G?). A composition according to the present invention is suitable for application with laser Induced Forward Transfer (LIFT).

Abstract: A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

Abstract: The present disclosure concerns a method and system for providing a patterned structure (3p) on an acceptor substrate 4). The method comprises providing a donor substrate (10) arranged between a light source (5) and an acceptor substrate (4). A mask (7) is arranged between the light source (5) and the donor substrate (10). The mask (7) comprises a mask pattern (7p) for patterning light (6). The patterned light (6p) impinging the donor substrate (10) causes the donor material (3) to be released from the donor substrate (10) and transfer to the acceptor substrate (4) to form the patterned structure (3p) thereon. The patterned light (6p) is divided by the mask pattern (7p) into a plurality of separate homogeneously sized beams (6b) simultaneously impinging the donor substrate (10) for causing the donor material (3) to be released from the donor substrate (10) in the form of separate homogeneously sized droplets (3d).

Abstract: A method for applying a patterned structure on a surface, comprising providing a donor substrate (1) comprising donor material (1a) between a light source (3) and a receiving surface (5), providing by means of the light source (3) a light pulse (3a) directed to the donor substrate (1), the light pulse (3a) being configured to cause the donor material (1a) to be transferred from the donor substrate (1) onto the receiving surface (5), wherein the donor substrate (1) comprises a pattern (2) of donor material (1a) on discrete portions (2a) of the donor substrate (1). The pattern (2) on the donor substrate (1) is transferred so as to form a pattern (4) of donor material (1a) on the receiving surface (5).

Abstract: An apparatus and method for soldering chips to a substrate. A substrate and two or more different chips having different heating properties are provided. A solder material is disposed between the chips and the substrate. A flash lamp generates a light pulse for heating the chips, wherein the solder material is at least partially melted by contact with the heated chips. A masking device is disposed between the flash lamp and the chips causing different light intensities in different areas of the light pulse passing the masking device thereby heating the chips with different light intensities. This may compensate the different heating properties to reduce a spread in temperature between the chips as a result of the heating by the light pulse.

Abstract: A substrate (3) and two or more different chips (1a, 1b) having different heating properties (e.g. caused by different dimensions (surface area and/or thickness), heat capacity (C1, C2), absorptivity, conductivity, number and/or size of solder bonds) are provided. A solder material (2) is disposed between the chips (1a, 1b) and the substrate (3). A flash lamp (5) generates a light pulse (6) for heating the chips (1a, 1b), wherein the solder material (2) is at least partially melted by contact with the heated chips (1a, 1b). A masking device (7) is disposed between the flash lamp (5) and the chips (1a, 1b) causing different light intensities (1a, 1b) in different areas (6a, 6b) of the light pulse (6) passing the masking device (7), thereby heating the chips (1a, 1b) with different light intensities (1a, 1b). This may compensate the different heating properties to reduce a spread in temperature between the chips (1a, 1b) as a result of the heating by the light pulse (6).

Abstract: Method and apparatus for assembling a component with a flexible foil, as well as assembled product A method is provided for assembling a component (20) with a flexible foil (10). The method comprising the steps of —providing (SI) a flexible foil (10) having a first side (11) with at least one liquid confinement zone (12) and at least one liquid confinement subzone (13) enclosed by the liquid confinement zone, —depositing (S2) an alignment liquid (30) in the at least one liquid confinement subzone (13), —moving (S3) the component (20) towards the liquid confinement zone, and bringing (S4) a surface (21) of the component facing the flexible foil into contact with the alignment liquid in the at least one liquid confinement subzone and releasing (S5) the component (20).

Abstract: Method and apparatus for assembling a component with a flexible foil, as well as assembled product A method is provided for assembling a component (20) with a flexible foil (10). The method comprising the steps of —providing (SI) a flexible foil (10) having a first side (11) with at least one liquid confinement zone (12) and at least one liquid confinement subzone (13) enclosed by the liquid confinement zone, —depositing (S2) an alignment liquid (30) in the at least one liquid confinement subzone (13), —moving (S3) the component (20) towards the liquid confinement zone, and bringing (S4) a surface (21) of the component facing the flexible foil into contact with the alignment liquid in the at least one liquid confinement subzone and releasing (S5) the component (20).