Abstract: Provided is a heater which includes a flexible printed wiring board, in which the flexible printed wiring board includes a base film, a first metal foil, and a second metal foil, the first metal foil forms a heater circuit portion that generates heat when energized, on a first surface of the base film, and the second metal foil forms a heat conductive foil portion that maintains a non-energized state, on a second surface of the base film.

Abstract: A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.

Abstract: A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.

Abstract: A method for manufacturing a printed-wiring board having an organic resin insulating layer and a metal wiring layer and having a film-like resistive element formed on the metal wiring layer thereof, the method including: disposing a metal wiring layer on one surface of one organic resin insulating layer 1 to form an organic resin printed-wiring board 4; forming a pair of electrodes 5 on the metal wiring layer of the organic resin printed-wiring board; forming a film-like resistive element 7 between the electrodes; applying a temperature and a pressure of a laminating press to the side of the metal wiring layer in the wiring board without use of a laminating adhesive agent to change a resistance value of the film-like resistive element; trimming the film-like resistive element for adjusting a resistance value; providing a circuit member 12 having at least one layer of insulating layer; and laminating the circuit member with a laminating adhesive agent 13 in between so as to contact with a layer of the organic

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.

Abstract: There is provided a capacitor-embedded printed wiring board incorporating therein a capacitor having stabilized electrical characteristics. The capacitor-embedded printed wiring board includes: a capacitor having a first electrode 5, a high dielectric constant layer 7 and a second electrode 9 which are sequentially laminated on an insulating substrate 1, the second electrode being electrically connected to a land 6 for electrode contact formed in a wiring layer in which the first electrode is formed; a member 12 having at least one insulating layer and laminated over the capacitor and the wiring layer; and a via 18 having an opening extending through the member and the second electrode to reach the land, the via electrically interconnecting the second electrode and the land in the opening. A method of manufacturing the same is also provided.

Abstract: A method for manufacturing a printed-wiring board having an organic resin insulating layer and a metal wiring layer and having a film-like resistive element formed on the metal wiring layer thereof, the method including: disposing a metal wiring layer on one surface of one organic resin insulating layer 1 to form an organic resin printed-wiring board 4; forming a pair of electrodes 5 on the metal wiring layer of the organic resin printed-wiring board; forming a film-like resistive element 7 between the electrodes; applying a temperature and a pressure of a laminating press to the side of the metal wiring layer in the wiring board without use of a laminating adhesive agent to change a resistance value of the film-like resistive element; trimming the film-like resistive element for adjusting a resistance value; providing a circuit member 12 having at least one layer of insulating layer; and laminating the circuit member with a laminating adhesive agent 13 in between so as to contact with a layer of the organic

Abstract: The present invention provides a method of producing a resistance element incorporated in a printed circuit board at an accuracy of resistance value of ±1% or less, at low cost and with a good yield while the resistance element formed by a resistor paste is incorporated.

Abstract: There is provided a method for manufacturing a wiring board with built-in capacitors in which small high-frequency capacitors, decoupling capacitors, and EMI filter capacitors can be built with precision by using the same method.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.