Abstract: A vision system of a vehicle includes a camera disposed at a vehicle windshield and viewing through the windshield and exterior of the vehicle. A light-absorbing hiding layer is established at the windshield at an area at which the camera is disposed and includes an portion established therethrough, with the portion aligned with the camera such that the camera views through the windshield via the portion. The portion comprises a wider central region and narrower upper and lower regions. The wider central region of the portion provides a wide angle field of view of the camera at a region ahead of the vehicle and the narrower lower region of the portion reduces the field of view at regions near to and sidewards from the front of the vehicle. An image processor is operable to process image data captured by the camera for a machine vision function or driver assistance system.

Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.

Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.

Abstract: A vision system of a vehicle includes a camera disposed at a vehicle windshield and viewing through the windshield and exterior of the vehicle. A light-absorbing hiding layer is established at the windshield at an area at which the camera is disposed and includes an portion established therethrough, with the portion aligned with the camera such that the camera views through the windshield via the portion. The portion comprises a wider central region and narrower upper and lower regions. The wider central region of the portion provides a wide angle field of view of the camera at a region ahead of the vehicle and the narrower lower region of the portion reduces the field of view at regions near to and sidewards from the front of the vehicle. An image processor is operable to process image data captured by the camera for a machine vision function or driver assistance system.

Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.