Patents by Inventor Garrett E. Clark

Garrett E. Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9511584
    Abstract: A print head die with thermal control is described. In an example, a print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; a temperature sensor formed on the substrate adjacent to a first one of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent to a last one of the liquid feed slots farthest from the first liquid feed slot.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: December 6, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Garrett E. Clark, Chris Bakker, Mark H. MacKenzie, Glenn D. McCloy
  • Patent number: 9475278
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: October 25, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • Patent number: 9365034
    Abstract: An apparatus and method support a plurality of print head dies (24, 324, 524) on a print bar (22, 322, 522). The plurality of print head dies (24, 324, 524) comprise a print head die (24, 324, 524) having a circuit (26, 526) forming a series (28, 328) of information bits (30), wherein bit locations in the series (28, 328) are mapped to information type definitions based on a location of the print head die (24, 324, 524) on the print bar (22, 322, 522) relative to other print head dies (24, 324, 524) on the print bar (22, 322, 522).
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: June 14, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Christopher H. Bakker, Yit Hong Tor, Glory J. Abadilla, Andrew Phillips, Glenn D. McCloy
  • Publication number: 20160009079
    Abstract: An apparatus and method support a plurality of print head dies (24, 324, 524) on a print bar (22, 322, 522). The plurality of print head dies (24, 324, 524) comprise a print head die (24, 324, 524) having a circuit (26, 526) forming a series (28, 328) of information bits (30), wherein bit locations in the series (28, 328) are mapped to information type definitions based on a location of the print head die (24, 324, 524) on the print bar (22, 322, 522) relative to other print head dies (24, 324, 524) on the print bar (22, 322, 522).
    Type: Application
    Filed: February 28, 2013
    Publication date: January 14, 2016
    Inventors: Garrett E. Clark, Christopher H. Bakker, Yit Hong Tor, Glory J. Abadilla, Andrew Phillips, Glenn D. Mccloy
  • Publication number: 20160001555
    Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.
    Type: Application
    Filed: September 10, 2015
    Publication date: January 7, 2016
    Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
  • Patent number: 9221256
    Abstract: A print head die is described. In one example, the print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent a last one of the liquid feed slots. A first one of the liquid feed slots opposite the last liquid feed slot and farthest from the electrical interconnect supplies an ink using a higher drop volume than inks in other ones of the liquid feed slots. The last liquid feed slot supplies an ink having a higher contrast with the ink in the first liquid feed slot than with inks in other ones of the liquid feed slots.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: December 29, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Chris Bakker, Mark H. MacKenzie, Michele D. Friesen
  • Patent number: 9211713
    Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: December 15, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
  • Patent number: 9199461
    Abstract: Various configurations of print head die are described. In an example, a first print head die has first print structures disposed along a major dimension thereof perpendicular to the media path, the first print structures including a leading print structure with respect to the media path. A second print head die independent of the first print head die has second print structures disposed along a major dimension thereof perpendicular to the media path, the second print head die being staggered with respect to the first print head die along the media path, the second print structures including a leading print structure with respect to the media path. A portion of the second print structures overlap a portion of the first print structures by an extent between a minimum value and a linear function of a separation between the respective leading print structures of the first and second print head dies.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: December 1, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mark H. Mackenzie, Garrett E. Clark
  • Publication number: 20150314599
    Abstract: A print head die is described. In one example, the print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent a last one of the liquid feed slots. A first one of the liquid feed slots opposite the last liquid feed slot and farthest from the electrical interconnect supplies an ink using a higher drop volume than inks in other ones of the liquid feed slots. The last liquid feed slot supplies an ink having a higher contrast with the ink in the first liquid feed slot than with inks in other ones of the liquid feed slots.
    Type: Application
    Filed: September 25, 2012
    Publication date: November 5, 2015
    Inventors: Garrett E. Clark, Chris Bakker, Mark H. MacKenzie, Michele D. Friesen
  • Patent number: 9126411
    Abstract: A fluid-jet precision-dispensing device includes a layer, one or more first holes within the layer, and one or more second holes within the layer. The first holes are adapted to pass fluid therethrough during usage of the device to precisely dispense the fluid at accurately specified locations. The second holes are adapted to not pass the fluid therethrough during usage of the device to precisely dispense the fluid at the accurately specified locations. The second holes may be adapted to at least substantially maximally pass gaseous bubbles therethrough during performance of a priming operation of the device. The second holes may be adapted to at least substantially maximally pass sludge and/or contaminants therethrough during performance of the priming operation of the device.
    Type: Grant
    Filed: May 25, 2008
    Date of Patent: September 8, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Elizabeth A. Visnyak, Glenn T. Haddick, Jaynie Schonbrod, Holli Ogle, Ralph L. Stathem, Garrett E. Clark, Jeffrey S. Hess, Phil Harding, Manish Giri, Gilbert G. Smith
  • Publication number: 20150239237
    Abstract: A print head die with thermal control is described. In an example, a print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; a temperature sensor formed on the substrate adjacent to a first one of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent to a last one of the liquid feed slots farthest from the first liquid feed slot.
    Type: Application
    Filed: September 25, 2012
    Publication date: August 27, 2015
    Applicant: Hewlett-Packard Development Company. L.P.
    Inventors: Garrett E. Clark, Chris Bakker, Mark H. MacKenzie, Glenn D. McCloy
  • Publication number: 20150145908
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Application
    Filed: June 18, 2012
    Publication date: May 28, 2015
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • Patent number: 9028031
    Abstract: A printhead system to reduce peak energy usage may include a printhead including a plurality of primitives including nozzles. A printhead control module may control the printhead to increase printed pixel resolution and to reduce peak pixel fill density for print media. The printhead control module may further control the printhead such that all the nozzles with a same address generally disposed in a column do not fire at the same time.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: May 12, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Chris Bakker, Eric T. Martin, Vincent Gerard Heesen, Mark H. Mackenzie
  • Publication number: 20150022575
    Abstract: A printhead system to reduce peak energy usage may include a printhead including a plurality of primitives including nozzles. A printhead control module may control the printhead to increase printed pixel resolution and to reduce peak pixel fill density for print media. The printhead control module may further control the printhead such that all the nozzles with a same address generally disposed in a column do not fire at the same time.
    Type: Application
    Filed: January 31, 2012
    Publication date: January 22, 2015
    Inventors: Garrett E. Clark, Chris Bakker, Eric T. Martin, Vincent Gerard Heesen, Mark H. Mackenzie
  • Patent number: 8919938
    Abstract: A droplet generator (100, 600, 700) having a bubble purging fluidic architecture comprises a firing chamber (110, 610, 710); an inlet (155, 655) fluidically connecting the firing chamber (110, 610, 710) to a fluid reservoir (140, 640, 740); and an outlet (120, 400, 620, 720) configured to pass fluid droplets being ejected from the firing chamber (110, 610, 710). The geometry of the outlet (120, 400, 620, 720) and the geometry of the inlet (155, 655) are configured such that the outlet (120, 400, 620, 720) geometry has a substantially lower barrier to expansion or motion of a bubble (300, 310, 410) than the inlet (155, 655) geometry.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: December 30, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Angela Bakkom
  • Publication number: 20140327720
    Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.
    Type: Application
    Filed: December 21, 2011
    Publication date: November 6, 2014
    Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
  • Patent number: 8141986
    Abstract: A heating element of a fluid ejection device includes an insulative layer, a resistor portion interposed between and spaced apart from a pair of conductive portions, and an upper structure defining a fluid chamber above the resistor portion. The insulative layer defines a shoulder portion adjacent a side edge of the resistor portion, the shoulder portion vertically spaced below a top surface of the resistor portion by a distance of no more than twice a thickness of the resistor portion.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: March 27, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Bhavin Shah, Anthony M. Fuller, Ozgur Yildirim, Garrett E. Clark
  • Publication number: 20110025785
    Abstract: Embodiments of a heating element of a fluid ejection device are disclosed.
    Type: Application
    Filed: October 12, 2010
    Publication date: February 3, 2011
    Inventors: Bradley D. Chung, Bhavin Shah, Anthony M. Fuller, Ozgur Yildirim, Garrett E. Clark
  • Patent number: 7862156
    Abstract: Embodiments of a heating element of a fluid ejection device are disclosed.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: January 4, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Bhavin Shah, Anthony M. Fuller, Ozgur Yildirim, Garrett E. Clark
  • Patent number: 7837886
    Abstract: A method of making a printhead comprises forming a resistor strip in a heating region of the printhead. In a first portion of the heating region, a resistive layer is formed including a central resistor region interposed between two spaced apart conductive elements. In the method, a conductive layer is removed from a bus region of the printhead while protecting the first portion of the heating region.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: November 23, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Bhavin Shah, Anthony M. Fuller, Ozgur Yildirim, Garrett E. Clark