Patents by Inventor Garrett E. Clark
Garrett E. Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9511584Abstract: A print head die with thermal control is described. In an example, a print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; a temperature sensor formed on the substrate adjacent to a first one of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent to a last one of the liquid feed slots farthest from the first liquid feed slot.Type: GrantFiled: September 25, 2012Date of Patent: December 6, 2016Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Garrett E. Clark, Chris Bakker, Mark H. MacKenzie, Glenn D. McCloy
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Patent number: 9475278Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.Type: GrantFiled: June 18, 2012Date of Patent: October 25, 2016Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
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Patent number: 9365034Abstract: An apparatus and method support a plurality of print head dies (24, 324, 524) on a print bar (22, 322, 522). The plurality of print head dies (24, 324, 524) comprise a print head die (24, 324, 524) having a circuit (26, 526) forming a series (28, 328) of information bits (30), wherein bit locations in the series (28, 328) are mapped to information type definitions based on a location of the print head die (24, 324, 524) on the print bar (22, 322, 522) relative to other print head dies (24, 324, 524) on the print bar (22, 322, 522).Type: GrantFiled: February 28, 2013Date of Patent: June 14, 2016Assignee: Hewlett-Packard Development Company, L.P.Inventors: Garrett E. Clark, Christopher H. Bakker, Yit Hong Tor, Glory J. Abadilla, Andrew Phillips, Glenn D. McCloy
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Publication number: 20160009079Abstract: An apparatus and method support a plurality of print head dies (24, 324, 524) on a print bar (22, 322, 522). The plurality of print head dies (24, 324, 524) comprise a print head die (24, 324, 524) having a circuit (26, 526) forming a series (28, 328) of information bits (30), wherein bit locations in the series (28, 328) are mapped to information type definitions based on a location of the print head die (24, 324, 524) on the print bar (22, 322, 522) relative to other print head dies (24, 324, 524) on the print bar (22, 322, 522).Type: ApplicationFiled: February 28, 2013Publication date: January 14, 2016Inventors: Garrett E. Clark, Christopher H. Bakker, Yit Hong Tor, Glory J. Abadilla, Andrew Phillips, Glenn D. Mccloy
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Publication number: 20160001555Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.Type: ApplicationFiled: September 10, 2015Publication date: January 7, 2016Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
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Patent number: 9221256Abstract: A print head die is described. In one example, the print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent a last one of the liquid feed slots. A first one of the liquid feed slots opposite the last liquid feed slot and farthest from the electrical interconnect supplies an ink using a higher drop volume than inks in other ones of the liquid feed slots. The last liquid feed slot supplies an ink having a higher contrast with the ink in the first liquid feed slot than with inks in other ones of the liquid feed slots.Type: GrantFiled: September 25, 2012Date of Patent: December 29, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Garrett E. Clark, Chris Bakker, Mark H. MacKenzie, Michele D. Friesen
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Patent number: 9211713Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.Type: GrantFiled: December 21, 2011Date of Patent: December 15, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
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Patent number: 9199461Abstract: Various configurations of print head die are described. In an example, a first print head die has first print structures disposed along a major dimension thereof perpendicular to the media path, the first print structures including a leading print structure with respect to the media path. A second print head die independent of the first print head die has second print structures disposed along a major dimension thereof perpendicular to the media path, the second print head die being staggered with respect to the first print head die along the media path, the second print structures including a leading print structure with respect to the media path. A portion of the second print structures overlap a portion of the first print structures by an extent between a minimum value and a linear function of a separation between the respective leading print structures of the first and second print head dies.Type: GrantFiled: September 25, 2012Date of Patent: December 1, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Mark H. Mackenzie, Garrett E. Clark
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Publication number: 20150314599Abstract: A print head die is described. In one example, the print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent a last one of the liquid feed slots. A first one of the liquid feed slots opposite the last liquid feed slot and farthest from the electrical interconnect supplies an ink using a higher drop volume than inks in other ones of the liquid feed slots. The last liquid feed slot supplies an ink having a higher contrast with the ink in the first liquid feed slot than with inks in other ones of the liquid feed slots.Type: ApplicationFiled: September 25, 2012Publication date: November 5, 2015Inventors: Garrett E. Clark, Chris Bakker, Mark H. MacKenzie, Michele D. Friesen
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Patent number: 9126411Abstract: A fluid-jet precision-dispensing device includes a layer, one or more first holes within the layer, and one or more second holes within the layer. The first holes are adapted to pass fluid therethrough during usage of the device to precisely dispense the fluid at accurately specified locations. The second holes are adapted to not pass the fluid therethrough during usage of the device to precisely dispense the fluid at the accurately specified locations. The second holes may be adapted to at least substantially maximally pass gaseous bubbles therethrough during performance of a priming operation of the device. The second holes may be adapted to at least substantially maximally pass sludge and/or contaminants therethrough during performance of the priming operation of the device.Type: GrantFiled: May 25, 2008Date of Patent: September 8, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Elizabeth A. Visnyak, Glenn T. Haddick, Jaynie Schonbrod, Holli Ogle, Ralph L. Stathem, Garrett E. Clark, Jeffrey S. Hess, Phil Harding, Manish Giri, Gilbert G. Smith
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Publication number: 20150239237Abstract: A print head die with thermal control is described. In an example, a print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; a temperature sensor formed on the substrate adjacent to a first one of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent to a last one of the liquid feed slots farthest from the first liquid feed slot.Type: ApplicationFiled: September 25, 2012Publication date: August 27, 2015Applicant: Hewlett-Packard Development Company. L.P.Inventors: Garrett E. Clark, Chris Bakker, Mark H. MacKenzie, Glenn D. McCloy
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Publication number: 20150145908Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.Type: ApplicationFiled: June 18, 2012Publication date: May 28, 2015Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
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Patent number: 9028031Abstract: A printhead system to reduce peak energy usage may include a printhead including a plurality of primitives including nozzles. A printhead control module may control the printhead to increase printed pixel resolution and to reduce peak pixel fill density for print media. The printhead control module may further control the printhead such that all the nozzles with a same address generally disposed in a column do not fire at the same time.Type: GrantFiled: January 31, 2012Date of Patent: May 12, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Garrett E. Clark, Chris Bakker, Eric T. Martin, Vincent Gerard Heesen, Mark H. Mackenzie
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Publication number: 20150022575Abstract: A printhead system to reduce peak energy usage may include a printhead including a plurality of primitives including nozzles. A printhead control module may control the printhead to increase printed pixel resolution and to reduce peak pixel fill density for print media. The printhead control module may further control the printhead such that all the nozzles with a same address generally disposed in a column do not fire at the same time.Type: ApplicationFiled: January 31, 2012Publication date: January 22, 2015Inventors: Garrett E. Clark, Chris Bakker, Eric T. Martin, Vincent Gerard Heesen, Mark H. Mackenzie
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Patent number: 8919938Abstract: A droplet generator (100, 600, 700) having a bubble purging fluidic architecture comprises a firing chamber (110, 610, 710); an inlet (155, 655) fluidically connecting the firing chamber (110, 610, 710) to a fluid reservoir (140, 640, 740); and an outlet (120, 400, 620, 720) configured to pass fluid droplets being ejected from the firing chamber (110, 610, 710). The geometry of the outlet (120, 400, 620, 720) and the geometry of the inlet (155, 655) are configured such that the outlet (120, 400, 620, 720) geometry has a substantially lower barrier to expansion or motion of a bubble (300, 310, 410) than the inlet (155, 655) geometry.Type: GrantFiled: December 20, 2007Date of Patent: December 30, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Garrett E. Clark, Angela Bakkom
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Publication number: 20140327720Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.Type: ApplicationFiled: December 21, 2011Publication date: November 6, 2014Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
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Patent number: 8141986Abstract: A heating element of a fluid ejection device includes an insulative layer, a resistor portion interposed between and spaced apart from a pair of conductive portions, and an upper structure defining a fluid chamber above the resistor portion. The insulative layer defines a shoulder portion adjacent a side edge of the resistor portion, the shoulder portion vertically spaced below a top surface of the resistor portion by a distance of no more than twice a thickness of the resistor portion.Type: GrantFiled: October 12, 2010Date of Patent: March 27, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Bradley D. Chung, Bhavin Shah, Anthony M. Fuller, Ozgur Yildirim, Garrett E. Clark
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Publication number: 20110025785Abstract: Embodiments of a heating element of a fluid ejection device are disclosed.Type: ApplicationFiled: October 12, 2010Publication date: February 3, 2011Inventors: Bradley D. Chung, Bhavin Shah, Anthony M. Fuller, Ozgur Yildirim, Garrett E. Clark
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Patent number: 7862156Abstract: Embodiments of a heating element of a fluid ejection device are disclosed.Type: GrantFiled: July 26, 2007Date of Patent: January 4, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Bradley D. Chung, Bhavin Shah, Anthony M. Fuller, Ozgur Yildirim, Garrett E. Clark
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Patent number: 7837886Abstract: A method of making a printhead comprises forming a resistor strip in a heating region of the printhead. In a first portion of the heating region, a resistive layer is formed including a central resistor region interposed between two spaced apart conductive elements. In the method, a conductive layer is removed from a bus region of the printhead while protecting the first portion of the heating region.Type: GrantFiled: July 26, 2007Date of Patent: November 23, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Bradley D. Chung, Bhavin Shah, Anthony M. Fuller, Ozgur Yildirim, Garrett E. Clark