Patents by Inventor Garrett Korpinen

Garrett Korpinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230253235
    Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 10, 2023
    Applicant: II-VI Delaware, Inc.
    Inventors: John W. Stayt, JR., Thomas Barrie, Raven Persaud, Garrett Korpinen, Geoffrey Robert Hale
  • Patent number: 11658059
    Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: May 23, 2023
    Assignee: II-VI Delaware, Inc.
    Inventors: John W. Stayt, Jr., Thomas Barrie, Raven Persaud, Garrett Korpinen, Geoffrey Robert Hale
  • Publication number: 20210208193
    Abstract: A wafer handling fixture is used to transport a finished semiconductor wafer from one post-fabrication procedure to another (e.g., testing, inspection, cleaning, dicing, or shipping) in a manner that maintains the wafer in its “flattened” form and eliminates the possibility for a wafer to later spring back into a bowed form. The wafer handling fixture includes a surface stiction film to which the wafer will naturally adhere, and uses a wafer release mechanism included in a bottom support plate to permit for the “controlled” transfer of the wafer from the handling fixture to testing/inspection equipment.
    Type: Application
    Filed: May 16, 2019
    Publication date: July 8, 2021
    Applicant: II-VI Delaware, Inc.
    Inventors: Raven Persaud, Liam Larkin, Thomas Barrie, Garrett Korpinen, John W. Stayt, Jr., Rajat Jain, Christopher T. Martin, George E. Harris
  • Publication number: 20190267276
    Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.
    Type: Application
    Filed: February 26, 2019
    Publication date: August 29, 2019
    Applicant: II-VI Delaware, Inc.
    Inventors: John W. Stayt, JR., Thomas Barrie, Raven Persaud, Garrett Korpinen, Geoffrey Robert Hale