Abstract: An example apparatus includes a cavity defined by a vehicle door, with the cavity being configured to stow and charge an accessory device. The apparatus may also include an accessory cradle movable within the cavity and configured to retain the vehicle accessory. Examples of a method may include providing a cavity in an end portion of a vehicle door, with the cavity being configured to stow and charge an accessory device. The method may further include installing an accessory cradle within the cavity, with the accessory cradle being movable within the cavity and configured to retain the vehicle accessory.

Abstract: A system, in certain embodiments, includes a power supply. The power supply includes an ultracapacitor configured to be charged by a DC source. The power supply also includes a first switch that enables charging of the ultracapacitor by the DC source when in a closed position and disables charging of the ultracapacitor when in an open position. The power supply further includes a second switch configured to enable discharging of the ultracapacitor when in a closed position and to disable discharging of the ultracapacitor when in an open position. As the ultracapacitor is discharged, a current is supplied to actuate a shape memory alloy element.

Abstract: A system, in certain embodiments, includes an accumulator having a first plate with a first plurality of holes and a second plate with a second plurality of holes. The second plate is positioned at an offset from the first plate, and the second plate is moveable relative to the first plate to adjust a fluid pressure. The accumulator also includes a plurality of shape memory alloy wires extending between the first and second plates, wherein the plurality of shape memory alloy wires extend through the first and second plurality of holes.

Abstract: A system, in certain embodiments, includes an accumulator having a first plate with a first wire guide and a second plate with a second wire guide. The second plate is positioned at an offset from the first plate, and the second plate is moveable relative to the first plate to adjust a fluid pressure. The accumulator also includes a plurality of shape memory alloy wires extending between the first and second plates, wherein the plurality of shape memory alloy wires extend along the first and second wire guides.

Abstract: A system, in certain embodiments, includes an accumulator having a first plate, a second plate positioned at an offset from the first plate, and a shape memory alloy wire extending between the first and second plates from a first wire portion to a second wire portion. The shape memory alloy wire is configured to move the first or second plate to adjust a fluid pressure in response to an electrical current through the shape memory alloy wire. The accumulator also includes a wire clamp assembly coupled to the first wire portion and/or the second wire portion of the shape memory alloy wire.

Abstract: A system, in certain embodiments, includes an accumulator having a first plate with a first wire guide and a second plate with a second wire guide. The second plate is positioned at an offset from the first plate, and the second plate is moveable relative to the first plate to adjust a fluid pressure. The accumulator also includes a plurality of shape memory alloy wires extending between the first and second plates, wherein the plurality of shape memory alloy wires extend along the first and second wire guides.

Abstract: A system, in certain embodiments, includes an accumulator having a first plate with a first plurality of holes and a second plate with a second plurality of holes. The second plate is positioned at an offset from the first plate, and the second plate is moveable relative to the first plate to adjust a fluid pressure. The accumulator also includes a plurality of shape memory alloy wires extending between the first and second plates, wherein the plurality of shape memory alloy wires extend through the first and second plurality of holes.

Abstract: A system, in certain embodiments, includes an accumulator having a first plate, a second plate positioned at an offset from the first plate, and a shape memory alloy wire extending between the first and second plates from a first wire portion to a second wire portion. The shape memory alloy wire is configured to move the first or second plate to adjust a fluid pressure in response to an electrical current through the shape memory alloy wire. The accumulator also includes a wire clamp assembly coupled to the first wire portion and/or the second wire portion of the shape memory alloy wire.

Abstract: A system, in certain embodiments, includes a power supply. The power supply includes an ultracapacitor configured to be charged by a DC source. The power supply also includes a first switch that enables charging of the ultracapacitor by the DC source when in a closed position and disables charging of the ultracapacitor when in an open position. The power supply further includes a second switch configured to enable discharging of the ultracapacitor when in a closed position and to disable discharging of the ultracapacitor when in an open position. As the ultracapacitor is discharged, a current is supplied to actuate a shape memory alloy element.

Abstract: Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.

Abstract: Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.