Patents by Inventor Garrett W. Oakley

Garrett W. Oakley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9059194
    Abstract: Partial removal of organic planarizing layer (OPL) material forms a plug of OPL material within an aperture that protects underlying material or electronic device such as a deep trench capacitor during other manufacturing processes. The OPL plug thus can absorb any differences or non-uniformity in, for example, etch rates across the chip or wafer and preserve recess dimensions previously formed. Control of a lateral component of later removal of the OPL plug by etching also can increase tolerance of overlay error in forming connections and thus avoid loss in manufacturing yield.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: June 16, 2015
    Assignee: International Business Machines Corporation
    Inventors: Colin J. Brodsky, Anne C. Friedman, Herbert Lei Ho, Byeong Yeol Kim, Dan Mihai Mocuta, Garrett W. Oakley, Chienfan Yu
  • Publication number: 20150102463
    Abstract: Partial removal of organic planarizing layer (OPL) material forms a plug of OPL material within an aperture that protects underlying material or electronic device such as a deep trench capacitor during other manufacturing processes. The OPL plug thus can absorb any differences or non-uniformity in, for example, etch rates across the chip or wafer and preserve recess dimensions previously formed. control of a lateral component of later removal of the OPL plug by etching also can increase tolerance of overlay error in forming connections and thus avoid loss in manufacturing yield.
    Type: Application
    Filed: December 22, 2014
    Publication date: April 16, 2015
    Inventors: Colin J. Brodsky, Anne C. Friedman, Herbert Lei Ho, Byeong Yeol Kim, Dan Mihai Mocuta, Garrett W. Oakley, Chienfan Yu
  • Publication number: 20140191366
    Abstract: Partial removal of organic planarizing layer (OPL) material forms a plug of OPL material within an aperture that protects underlying material or electronic device such as a deep trench capacitor during other manufacturing processes. The OPL plug thus can absorb any differences or non-uniformity in, for example, etch rates across the chip or wafer and preserve recess dimensions previously formed. control of a lateral component of later removal of the OPL plug by etching also can increase tolerance of overlay error in forming connections and thus avoid loss in manufacturing yield.
    Type: Application
    Filed: January 10, 2013
    Publication date: July 10, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Colin J. Brodsky, Anne C. Friedman, Herbert Lei Ho, Byeong Yeol Kim, Dan Mihai Mocuta, Garrett W. Oakley, Chienfan Yu
  • Patent number: 6660813
    Abstract: An in-situ method for performing organic metathesis polymer chemistry in the solid state includes the step of providing an organic monomer and a catalyst, the catalyst for driving a metathesis polymerization reaction of the monomer. The organic monomer can be provided as a liquid monomer. The reaction produces reaction products including a polymeric end product and at least one volatile reaction product. At least a portion of the volatile reaction product is removed during the reaction to favor formation of the reaction product. Significantly, the reaction is performed at a temperature being below an average melting point of the polymeric end product such that at least a portion of the reaction is performed in the solid phase.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: December 9, 2003
    Assignee: University of Florida
    Inventors: Kenneth B. Wagener, Stephen E. Lehman, Jr., Garrett W. Oakley, Jason A. Smith
  • Publication number: 20030027962
    Abstract: An in-situ method for performing organic metathesis polymer chemistry in the solid state includes the step of providing an organic monomer and a catalyst, the catalyst for driving a metathesis polymerization reaction of the monomer. The organic monomer can be provided as a liquid monomer. The reaction produces reaction products including a polymeric end product and at least one volatile reaction product. At least a portion of the volatile reaction product is removed during the reaction to favor formation of the reaction product. Significantly, the reaction is performed at a temperature being below an average melting point of the polymeric end product such that at least a portion of the reaction is performed in the solid phase.
    Type: Application
    Filed: August 1, 2002
    Publication date: February 6, 2003
    Inventors: Kenneth B. Wagener, Stephen E. Lehman, Garrett W. Oakley, Jason A. Smith