Abstract: An ion-trap chip carrier (10) comprises a generally planar carrier substrate, the substrate having a front surface, a rear surface, and a chip receptacle. A chip support (22) is disposed in the chip receptacle of the carrier substrate, the chip support including at least one generally planar flange (22) extending in or generally parallel to a plane of the carrier substrate, and at least one aperture therein. The chip support comprises a chip receiving zone. The at least one chip support includes at least one front facing electrical terminal (15, 17) in the chip receiving zone, for coupling to a rear facing terminal of an ion-trap chip (50). At least one front facing wire bonding terminal (80, 82) is electrically coupled to the at least one front facing electrical terminal (15, 17), the at least one front facing wire bonding terminal being disposed outside of the chip receiving zone.

Abstract: Example embodiments of the present disclosure provide an optical module sensor. An example optical module sensor may include an optical radiation-emitting device, a reference, an optical radiation receiver positioned, an electromagnetic interference shield, and a housing cap. The housing cap may include a barrier wall positioned such that the housing cap defines a transmission cavity and a receiving cavity. The optical radiation-emitting device and the reference sensor may be positioned within the transmission cavity and the optical radiation receiver may be positioned within the receiving cavity. The housing cap may include an attenuation wall positioned between the reference sensor and the optical radiation receiver.

Abstract: An ion-trap chip carrier (10) comprises a generally planar carrier substrate, the substrate having a front surface, a rear surface, and a chip receptacle. A chip support (22) is disposed in the chip receptacle of the carrier substrate, the chip support including at least one generally planar flange (22) extending in or generally parallel to a plane of the carrier substrate, and at least one aperture therein. The chip support comprises a chip receiving zone. The at least one chip support includes at least one front facing electrical terminal (15, 17) in the chip receiving zone, for coupling to a rear facing terminal of an ion-trap chip (50). At least one front facing wire bonding terminal (80, 82) is electrically coupled to the at least one front facing electrical terminal (15, 17), the at least one front facing wire bonding terminal being disposed outside of the chip receiving zone.