Patents by Inventor Garry L. Renner

Garry L. Renner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140160624
    Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
    Type: Application
    Filed: December 4, 2013
    Publication date: June 12, 2014
    Applicant: Kemet Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell
  • Publication number: 20140002952
    Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
    Type: Application
    Filed: August 6, 2013
    Publication date: January 2, 2014
    Applicant: Kemet Electrinics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, Allen Hill
  • Publication number: 20130146347
    Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 13, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey Bell
  • Publication number: 20110292567
    Abstract: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
    Type: Application
    Filed: May 24, 2011
    Publication date: December 1, 2011
    Applicant: Kemet Electronics Corporation
    Inventors: John E. McConnell, John Bultitude, Reggie Phillips, Robert Allen Hill, Garry L. Renner, Philip M. Lessner, Antony P. Chacko, Jeffrey Bell, Keith Brown
  • Patent number: 6205649
    Abstract: A ceramic heater which has an alumina rod, an alumina based ribbon sintered to the rod, and a platinum resistor element bonded to the ribbon. Additionally, a method of making a ceramic heater by preparing a ceramic slurry; combining the ceramic slurry with a binder component to form a slip; depositing the slip onto a carrier film at a controlled thickness such that a deposited slip is formed; heat curing the deposited slip to form a cured slip ribbon; applying a platinum paste onto the ribbon in a specific pattern, the paste forming a platinum resistor element on the ribbon; applying the ribbon with the platinum resistor element onto an alumina rod; and, heating the rod with the ribbon and the platinum resistor element thereon, whereby the ribbon is sintered to the rod and the platinum resistor element is sintered and bonded to the ribbon.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: March 27, 2001
    Inventors: Mark A. Clayton, Garry L. Renner, Mark J. Cresanti